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EFC4612R-S-TR - onsemi

Description: Common-Drain type; 2.5 V drive; ESD Diode-Protected Gate; RoHS compliance

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Symbol
EFC4612R-S-TR - onsemi - PCB symbol
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PCB Footprints
EFC4612R-S-TR - onsemi PCB footprint - Other - Other - WLCSP4, 1.3x1.3, CASE 567DP
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3D Models
EFC4612R-S-TR - onsemi - 3D model - Other - WLCSP4, 1.3x1.3, CASE 567DP
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EFC4612R-S-TR Details

  • Manufacturer Part Number:

    EFC4612R-S-TR

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    WLCSP4, 1.3x1.3 / EFCP1313 4CC 037

  • Manufacturer Package Code:

    567DP

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Configuration:

    COMMON DRAIN, 2 ELEMENTS WITH BUILT-IN DIODE AND RESISTOR

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    S-PBGA-B4

  • JESD-609 Code:

    e1

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    2

  • Number of Terminals:

    4

  • Operating Mode:

    DEPLETION MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    1.6 W

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

EFC4612R-S-TR Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 oz copper thickness and a thermal relief pattern under the device.
  • Implement a robust thermal management system, including a heat sink, thermal interface material, and a cooling fan if necessary. Monitor the device's junction temperature and adjust the system design accordingly.
  • Use a reflow soldering process with a peak temperature of 260°C (500°F) and a dwell time of 20-30 seconds. Ensure the device is handled in accordance with the JEDEC J-STD-020 standard.
  • Handle the device in an ESD-controlled environment, using wrist straps, anti-static bags, and ESD-safe workstations. Ensure all equipment and tools are properly grounded.
  • Store the device in its original packaging, away from direct sunlight and moisture. Handle the device by the body, avoiding touching the pins or leads. Use anti-static materials and follow the JEDEC J-STD-033 standard.

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EFC4612R-S-TR Overview

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