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EFC8811R-TF - onsemi

Description: RoHS compliance; 2.5 V drive; 2 kV ESD HBM; Common-Drain Type; ESD Diode-Protected Gate

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Symbol
EFC8811R-TF - onsemi - PCB symbol
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PCB Footprints
EFC8811R-TF - onsemi PCB footprint - Other - Other - EFC8811R-TF-1
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3D Models
EFC8811R-TF - onsemi - 3D model - Other - EFC8811R-TF-1
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EFC8811R-TF Details

  • Manufacturer Part Number:

    EFC8811R-TF

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    CSP-6

  • Manufacturer Package Code:

    568AL

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Case Connection:

    SOURCE

  • Configuration:

    COMMON DRAIN, 2 ELEMENTS WITH BUILT-IN DIODE AND RESISTOR

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-PBCC-N6

  • Number of Elements:

    2

  • Number of Terminals:

    6

  • Operating Mode:

    DEPLETION MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    2.5 W

  • Surface Mount:

    YES

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

EFC8811R-TF Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1mm clearance around the device for airflow and heat dissipation.
  • Implement a robust thermal management system, including a heat sink and thermal interface material. Ensure the device is operated within the recommended junction temperature range (TJ) of -40°C to 150°C.
  • Monitor the device's temperature, voltage, and current. Implement over-temperature protection (OTP), over-voltage protection (OVP), and over-current protection (OCP) to prevent damage and ensure reliable operation.
  • Consult the application notes and reference designs provided by onsemi. Optimize the device's configuration, including the selection of external components, to meet specific application requirements such as output voltage, current, and switching frequency.
  • Follow the recommended soldering temperature profile and assembly guidelines provided in the datasheet. Ensure proper handling and storage of the device to prevent damage during assembly and rework.

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EFC8811R-TF Overview

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