The recommended land pattern for EKMC2607111K is a rectangular pad with a size of 2.5mm x 1.25mm, with a 0.5mm radius corner and a 0.3mm solder mask clearance.
To ensure proper thermal management, it is recommended to provide a thermal pad on the PCB with a size of at least 5mm x 5mm, and to use a thermal interface material (TIM) with a thermal conductivity of at least 1 W/mK.
The maximum operating temperature range for EKMC2607111K is -40°C to 125°C, with a derating of 1.25mA/°C above 85°C.
To ensure reliability in high-vibration environments, it is recommended to use a secure mounting method, such as a screw or adhesive, and to follow the recommended PCB design guidelines to minimize stress on the component.
The recommended storage condition for EKMC2607111K is in a dry, cool place with a temperature range of 5°C to 30°C and a relative humidity of 60% or less.
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EKMC2607111K Overview
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