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EL8172FSZ-T7 - Renesas Electronics

Description: The EL8171 and EL8172 are micropower instrumentation amplifiers optimized for single supply operation over the +2. 4V to +5. 5V range. Inputs and outputs can operate rail-to-rail. As with all instrumentation amplifiers, a pair of inputs provide very high common-mode rejection and are completely independent from a pair of feedback terminals. The feedback terminals allow zero input to be translated to any output offset, including ground. A feedback divider controls the overall gain of the amplifier. The EL817

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EL8172FSZ-T7 - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - MDP0027
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EL8172FSZ-T7 - Renesas Electronics  - 3D model - Small Outline Packages - MDP0027
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EL8172FSZ-T7 Details

  • Manufacturer Part Number:

    EL8172FSZ-T7

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOICN

  • Package Description:

    SOIC-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    M8.15E

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Factory Lead Time:

    4 Weeks

  • Date Of Intro:

    2017-10-06

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Amplifier Type:

    INSTRUMENTATION AMPLIFIER

  • Average Bias Current-Max (IIB):

    0.004 µA

  • Bandwidth (3dB)-Nom:

    0.17 MHz

  • Common-mode Reject Ratio-Min:

    75 dB

  • Input Offset Current-Max (IIO):

    0.0005 µA

  • Input Offset Voltage-Max:

    0.7 µV

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9022 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.7272 mm

  • Slew Rate-Nom:

    0.55 V/us

  • Supply Current-Max:

    0.11 mA

  • Supply Voltage Limit-Max:

    5.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9116 mm

EL8172FSZ-T7 Frequently Asked Questions (FAQs)

  • Renesas provides a recommended PCB layout in the application note 'EL8172FSZ-T7 Thermal Design Guide' (document number R01CL0005EJ0100). It suggests using a 4-layer PCB with a thermal relief pattern on the bottom layer to improve heat dissipation.
  • To ensure reliable operation in high-temperature environments, follow the recommended operating conditions, use a suitable heat sink, and implement thermal monitoring and protection mechanisms. Renesas also recommends using a thermal interface material (TIM) with a thermal conductivity of at least 1 W/mK.
  • Although the datasheet specifies the recommended operating voltage range, it's essential to note that the maximum allowed voltage on the input pins is 6.5V, which is higher than the recommended maximum operating voltage of 5.5V. Exceeding this voltage may damage the device.
  • Renesas recommends using ESD protection devices, such as TVS diodes or ESD arrays, on the input lines to protect the EL8172FSZ-T7 from electrostatic discharge. Additionally, follow proper handling and storage procedures to prevent ESD damage.
  • Renesas recommends powering up the VCC pin first, followed by the VIN pin. This sequence helps prevent latch-up and ensures proper device operation. A power-up sequence diagram is provided in the datasheet.

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