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EL8172FSZ - Renesas Electronics

Description: The EL8171 and EL8172 are micropower instrumentation amplifiers optimized for single supply operation over the +2. 4V to +5. 5V range. Inputs and outputs can operate rail-to-rail. As with all instrumentation amplifiers, a pair of inputs provide very high common-mode rejection and are completely independent from a pair of feedback terminals. The feedback terminals allow zero input to be translated to any output offset, including ground. A feedback divider controls the overall gain of the amplifier. The EL817

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EL8172FSZ - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - M8. 15E
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EL8172FSZ Details

  • Manufacturer Part Number:

    EL8172FSZ

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOICN

  • Package Description:

    SOIC-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    M8.15E

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Factory Lead Time:

    4 Weeks

  • Date Of Intro:

    2017-10-06

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Amplifier Type:

    INSTRUMENTATION AMPLIFIER

  • Average Bias Current-Max (IIB):

    0.004 µA

  • Bandwidth (3dB)-Nom:

    0.17 MHz

  • Common-mode Reject Ratio-Min:

    75 dB

  • Input Offset Current-Max (IIO):

    0.0005 µA

  • Input Offset Voltage-Max:

    0.7 µV

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9022 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TUBE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.7272 mm

  • Slew Rate-Nom:

    0.55 V/us

  • Supply Current-Max:

    0.11 mA

  • Supply Voltage Limit-Max:

    5.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9116 mm

EL8172FSZ Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or a heat sink to dissipate heat efficiently.
  • Ensure that the device is operated within the recommended temperature range (–40°C to +125°C). Use a heat sink or thermal pad to dissipate heat, and consider using a thermal interface material to improve heat transfer.
  • The critical timing parameters include the input rise and fall times (tr and tf), the propagation delay (tpd), and the output enable time (toe). These parameters are critical for ensuring reliable operation and should be carefully considered during design.
  • The EL8172FSZ has built-in ESD protection, but additional protection measures may be necessary depending on the application. Consider using external ESD protection devices or following ESD-safe handling and assembly practices.
  • The power supplies (VCC and VEE) should be sequenced to ensure that VCC is powered up before VEE. A power-on reset (POR) circuit can be used to ensure proper power sequencing.

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EL8172FSZ Overview

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