The recommended land pattern for the ELKE103FA is a rectangular pad with a size of 2.5mm x 1.25mm, with a solder mask opening of 2.2mm x 1.0mm.
During reflow soldering, the ELKE103FA should be placed on a flat surface, and the soldering temperature should be set between 220°C to 240°C for 10-30 seconds. Avoid applying excessive force or vibration during the process.
The maximum operating temperature for the ELKE103FA is 125°C, with a derating of 1.25% per °C above 85°C.
The ELKE103FA is not designed for use in humid environments. It is recommended to use a moisture-proof coating or conformal coating to protect the component from moisture.
The ELKE103FA should be stored in a dry, cool place, away from direct sunlight and moisture. The storage temperature should be between -20°C to 40°C, and the humidity should be below 60%.
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ELKE103FA Overview
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