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EM773FHN33,551 - NXP

Description: HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7  7  0.85 mm

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Symbol
EM773FHN33,551 - NXP - PCB symbol
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PCB Footprints
EM773FHN33,551 - NXP PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - HVQFN33
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3D Models
EM773FHN33,551 - NXP - 3D model - Quad Flat No-Lead - HVQFN33
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EM773FHN33,551 Details

  • Manufacturer Part Number:

    EM773FHN33,551

  • Brand Name:

    NXP Semiconductor

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    QFN

  • Package Description:

    HVQFN-33

  • Pin Count:

    32

  • Manufacturer Package Code:

    SOT865-3

  • HTS Code:

    8542.31.00.30

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    0

  • JESD-30 Code:

    S-PQCC-N33

  • Length:

    7 mm

  • Number of Terminals:

    33

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Seated Height-Max:

    1 mm

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    1.8 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    QUAD

  • Width:

    7 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROPROCESSOR CIRCUIT

EM773FHN33,551 Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the antenna area clear of copper and ensure a 50-ohm impedance matching network for optimal performance.
  • Use the lowest possible frequency and transmission power settings for your application. Enable the low-power mode (LPM) and adjust the transmission duty cycle to minimize power consumption.
  • The EM773FHN33,551 can operate from -40°C to +85°C, but the optimal operating temperature range is between 0°C and 70°C for reliable performance and longevity.
  • Implement error correction mechanisms like CRC and retransmission protocols. Use a robust modulation scheme and ensure a clear line of sight between the transmitter and receiver. Optimize the antenna design and placement for optimal performance.
  • Use a 10uF capacitor for decoupling, a 1kΩ resistor for the reset pin, and a 10kΩ resistor for the chip enable pin. Ensure the external components are compatible with the device's operating frequency and voltage range.

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EM773FHN33,551 Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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