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EMC2305-1-AP-TR - Microchip

Description: MICROCHIP - EMC2305-1-AP-TR - Motor Driver/Controller, PWM, 3V to 3.6V, 5 Outputs, QFN-16

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Symbol
EMC2305-1-AP-TR - Microchip - PCB symbol
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PCB Footprints
EMC2305-1-AP-TR - Microchip PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - QFN16
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3D Models
EMC2305-1-AP-TR - Microchip - 3D model - Quad Flat No-Lead - QFN16
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EMC2305-1-AP-TR Details

  • Manufacturer Part Number:

    EMC2305-1-AP-TR

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    QFN

  • Package Description:

    QFN-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    VQFN-16

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    14 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    9

  • Analog IC - Other Type:

    DC SERVO MOTOR CONTROLLER

  • JESD-30 Code:

    S-PQCC-N16

  • JESD-609 Code:

    e3

  • Length:

    4 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC16,.16SQ,25

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1 mm

  • Supply Current-Max (Isup):

    0.8 mA

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    4 mm

EMC2305-1-AP-TR Frequently Asked Questions (FAQs)

  • A good thermal design should be used to ensure the device operates within the recommended temperature range. A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat. Additionally, thermal vias can be used to connect the thermal pad to the copper area.
  • To ensure reliable operation in high-vibration environments, it is recommended to use a secure mounting method, such as screwing or adhesive, to attach the device to the PCB. Additionally, the PCB should be designed to minimize flexure and vibration transmission to the device.
  • The recommended decoupling capacitors for the EMC2305-1-AP-TR are 0.1uF to 1uF ceramic capacitors, placed as close as possible to the device's power pins. These capacitors help to filter out noise and ensure stable operation.
  • To troubleshoot issues with the I2C interface, check the I2C clock frequency, ensure that the I2C bus is not overloaded, and verify that the device is properly addressed. Additionally, use a logic analyzer or oscilloscope to monitor the I2C bus signals and identify any errors or anomalies.
  • The EMC2305-1-AP-TR has a maximum junction temperature of 150°C. Ensure that the device is operated within the recommended temperature range to prevent overheating. A good thermal design, including a heat sink or thermal pad, can help to dissipate heat and prevent thermal issues.

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EMC2305-1-AP-TR Overview

Use the download button to access the EMC2305-1-AP-TR schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like EMC23, or try a keyword search, such as Motion Control Electronics

About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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