A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
The device requires a stable input voltage (VIN) and a bypass capacitor (CBYP) to ensure proper biasing. A 10uF capacitor is recommended for CBYP.
The maximum power dissipation is 1.5W. Exceeding this limit may cause the device to overheat and reduce its lifespan.
The device is rated for operation up to 125°C. However, derating is required for temperatures above 85°C to ensure reliable operation.
Handle the device with an ESD wrist strap or mat, and ensure the PCB has ESD protection circuits, such as TVS diodes, to prevent damage.
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EMH11FHAT2R Overview
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