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EMH2418R-TL-H - onsemi

Description: Obsolete - Pch+Nch Power MOSFET, 20V, 4A, 45mΩ, -20V, -3A, 85mΩ, Complementary Dual EMH8

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PCB Footprints
EMH2418R-TL-H - onsemi PCB footprint - Other - Other - SOT−383FL / EMH8 CASE 419AT ISSUE O
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3D Models
EMH2418R-TL-H - onsemi  - 3D model - Other - SOT−383FL / EMH8 CASE 419AT ISSUE O
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EMH2418R-TL-H Details

  • Manufacturer Part Number:

    EMH2418R-TL-H

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOT-383FL / EMH8

  • Manufacturer Package Code:

    419AT

  • ECCN Code:

    EAR99

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Configuration:

    SEPARATE, 2 ELEMENTS

  • DS Breakdown Voltage-Min:

    24 V

  • Drain Current-Max (ID):

    9 A

  • Drain-source On Resistance-Max:

    40 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-PDSO-F8

  • JESD-609 Code:

    e6

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    2

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation Ambient-Max:

    1.3 W

  • Power Dissipation-Max (Abs):

    1.3 W

  • Pulsed Drain Current-Max (IDM):

    1.3 A

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin/Bismuth (Sn/Bi)

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

EMH2418R-TL-H Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing thermal vias under the device, using a solid ground plane, and keeping the thermal path as short as possible. It's also recommended to use a thermal pad on the bottom of the device and to connect it to a heat sink or a thermal plane.
  • To ensure reliable operation in high-temperature environments, it's essential to follow the recommended operating conditions, provide adequate heat sinking, and ensure good airflow around the device. Additionally, consider using thermal interface materials and conformal coatings to protect the device from moisture and humidity.
  • The EMH2418R-TL-H has built-in ESD protection, but it's still important to follow standard ESD handling precautions when handling the device. This includes using an ESD wrist strap, ESD mat, or ESD bag, and avoiding touching the device's pins or leads.
  • Yes, the EMH2418R-TL-H is suitable for high-reliability and automotive applications. It's AEC-Q101 qualified and meets the requirements for automotive-grade reliability. However, it's essential to follow the recommended operating conditions and design guidelines to ensure reliable operation in these applications.
  • To troubleshoot issues with the EMH2418R-TL-H, start by checking the device's operating conditions, such as voltage, current, and temperature. Verify that the device is properly soldered and that the PCB layout is correct. Use oscilloscopes or logic analyzers to debug the device's behavior, and consult the datasheet and application notes for guidance.

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EMH2418R-TL-H Overview

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