EML30US24-P footprint, schematic symbol and 3D model by XP POWER

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PCB Footprints

EML30US24-P - XP POWER PCB footprint - Other - Other - EML30-P

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3D Models

EML30US24-P - XP POWER - 3D model - Other - EML30-P

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Datasheet Download Datasheet
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Part Number EML30US24-P
Manufacturer XP POWER
Pin Count 4
Part Category Power Supply
Package Category Other
Footprint Name Other - EML30-P
Released Date Jun 19, 2018
Last Modified Date Mar 7, 2023 4:10 PM UTC
Pinout / Pin List Click Here (Member Only)

EML30US24-P Details

Manufacturer Part Number:
EML30US24-P
Pbfree Code:
Yes
Rohs Code:
Yes
Part Life Cycle Code:
Active
Package Description:
PACKAGE-4
ECCN Code:
EAR99
Date Of Intro:
2019-06-11
Manufacturer:
XP Power
YTEOL:
7
Additional Feature:
120-370 VDC ADDITIONAL INPUT IS AVAILABLE
Analog IC - Other Type:
AC-DC REGULATED POWER SUPPLY MODULE
Approvals:
AAMI, ANSI, CB, CE, CSA, EN, ES, IEC, TUV, UKCA,UL
Efficiency (Main Output):
88%
Input Voltage-Max:
264 V
Input Voltage-Min:
85 V
Input Voltage-Nom:
115 V
JESD-30 Code:
R-XDMA-P4
Length:
75.2 mm
Line Regulation-Max:
0.5%
Load Regulation-Max:
1%
Number of Functions:
1
Number of Outputs:
1
Number of Terminals:
4
Operating Temperature-Max:
70 °C
Operating Temperature-Min:
-20 °C
Output Current-Max:
1.63 A
Output Voltage-Max:
25.2 V
Output Voltage-Min:
22.8 V
Output Voltage-Nom:
24 V
Package Code:
DMA
Package Equivalence Code:
MODULE,4LEAD,2.8
Package Shape:
RECTANGULAR
Package Style:
MICROELECTRONIC ASSEMBLY
Protections:
OVER LOAD, OVER VOLTAGE, SHORT CIRCUIT
Ripple Voltage (Main Out):
0.07 Vrms
Screening Level:
EN/ES/IEC 60601-1, TWO MOPP
Seated Height-Max:
27.2 mm
Surface Mount:
NO
Technology:
HYBRID
Terminal Form:
PIN/PEG
Terminal Position:
DUAL
Total Power Output-Max:
30 W
Trim/Adjustable Output:
YES
Warm-up Time:
2.014 s
Width:
34.6 mm

EML30US24-P Frequently Asked Questions (FAQs)

XP Power recommends a PCB layout with a large copper area for heat dissipation, and a thermal management system with a heat sink and thermal interface material to keep the junction temperature below 125°C.
To ensure EMC, XP Power recommends following the layout and grounding guidelines in the datasheet, using a metal enclosure, and adding EMI filters and shielding as necessary to meet the relevant EMC standards.
The derating curve for the EML30US24-P is typically provided in the datasheet or can be obtained from XP Power's application notes. It shows the reduction in output power as a function of temperature, and engineers should use this curve to ensure the module operates within its specified ratings.
The EML30US24-P is designed to meet the vibration and shock requirements of IEC 60068-2-6 and IEC 60068-2-27, respectively. However, engineers should consult XP Power's application notes and perform additional testing to ensure the module meets the specific requirements of their application.
The MTBF of the EML30US24-P is typically provided in the datasheet or can be obtained from XP Power's reliability reports. Engineers should use this data to estimate the module's reliability and plan for maintenance and replacement schedules accordingly.

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EML30US24-P - XP POWER

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