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EN5336QI - Intel

Description: DC DC CONVERTER 0.75-6V 18W

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EN5336QI - Intel - PCB symbol
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PCB Footprints
EN5336QI - Intel PCB footprint - Other - Other - EN5336QI-1
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3D Models
EN5336QI - Intel - 3D model - Other - EN5336QI-1
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EN5336QI Details

  • Manufacturer Part Number:

    EN5336QI

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    ROHS COMPLIANT, QFN-44

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    0

  • Additional Feature:

    OPERATES IN ADJUSTABLE MODE FROM 0.75V TO 6V

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Mode:

    VOLTAGE-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    6.6 V

  • Input Voltage-Min:

    2.375 V

  • Input Voltage-Nom:

    5.5 V

  • JESD-30 Code:

    R-XQCC-N44

  • JESD-609 Code:

    e3

  • Length:

    10 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    44

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    3 A

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HQCCN

  • Package Equivalence Code:

    LCC44,.29X.39,25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.9 mm

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK

  • Switching Frequency-Max:

    5000 kHz

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    7.5 mm

EN5336QI Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the signal traces short and away from noise sources. Use a 50-ohm impedance-controlled trace for the high-speed signals.
  • Implement a robust thermal design, including a heat sink and thermal interface material. Ensure good airflow and avoid blocking airflow to the device. Consider using a thermal sensor to monitor the device temperature.
  • Use a combination of high-frequency and low-frequency decoupling capacitors (e.g., 0.1uF and 10uF) placed close to the device's power pins. Ensure the capacitors have a low equivalent series resistance (ESR) and are rated for the operating voltage.
  • Use a high-speed oscilloscope to verify the clock signals. Check the clock signal quality, frequency, and phase alignment. Verify the device's clock configuration and synchronization settings. Consult the Intel documentation and application notes for specific guidance.
  • Implement proper shielding, grounding, and filtering to minimize EMI. Use a metal enclosure and ensure good electromagnetic shielding. Follow Intel's guidelines for EMI and EMC compliance.

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EN5336QI Overview

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