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EP1S20F672C7 - Intel

Description: IC FPGA 426 I/O 672FBGA

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Symbol
EP1S20F672C7 - Intel - PCB symbol
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PCB Footprints
EP1S20F672C7 - Intel PCB footprint - BGA - BGA - 672-Pin FineLine BGA
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3D Models
EP1S20F672C7 - Intel - 3D model - BGA - 672-Pin FineLine BGA
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EP1S20F672C7 Details

  • Manufacturer Part Number:

    EP1S20F672C7

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    35 X 35 MM, 1.27 MM PITCH, BGA-672

  • HTS Code:

    8542.31.00.60

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    0

  • JESD-30 Code:

    S-PBGA-B672

  • JESD-609 Code:

    e0

  • Length:

    27 mm

  • Moisture Sensitivity Level:

    3

  • Number of CLBs:

    2132

  • Number of Inputs:

    426

  • Number of Logic Cells:

    18460

  • Number of Outputs:

    426

  • Number of Terminals:

    672

  • Operating Temperature-Max:

    85 °C

  • Organization:

    1846 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA672,26X26,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    3.5 mm

  • Supply Voltage-Max:

    1.575 V

  • Supply Voltage-Min:

    1.425 V

  • Supply Voltage-Nom:

    1.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL EXTENDED

  • Terminal Finish:

    Tin/Lead (Sn/Pb)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    27 mm

EP1S20F672C7 Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for EP1S20F672C7 is -40°C to 100°C, with a junction temperature of up to 125°C.
  • To implement CDC in EP1S20F672C7, you need to use synchronizers or FIFOs to transfer data between clock domains. Intel provides guidelines and IP cores for CDC in their documentation and development kits.
  • The maximum frequency of operation for EP1S20F672C7 is 250 MHz, but it can be overclocked to 300 MHz with proper cooling and power management.
  • To optimize power consumption in EP1S20F672C7, you can use power-saving features like clock gating, voltage scaling, and dynamic voltage and frequency scaling (DVFS). Additionally, you can optimize your design to reduce switching activity and use low-power modes when possible.
  • The maximum amount of memory that can be connected to EP1S20F672C7 is 16 MB of external memory, using the device's 16-bit external memory interface.

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EP1S20F672C7 Overview

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To find more CAD model downloads similar to this part, try a partial part number search, like EP1S2, or try a keyword search, such as Field Programmable Gate Arrays

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EP1S20F672C7 Alternates

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Image Part Number Model
Part Image EP1S20F672I7 Altera Corporation

Field Programmable Gate Array, 18460-Cell, CMOS, PBGA672
Part Image EP1S20F672I7N Altera Corporation

Field Programmable Gate Array, 18460-Cell, CMOS, PBGA672
Part Image EP1S20F672C7 Altera Corporation

Field Programmable Gate Array, 2132 CLBs, 18460-Cell, CMOS, PBGA672
Part Image EP1S20F672C7N Intel Corporation

Field Programmable Gate Array, 1846 CLBS, 18460-Cell, CMOS, PBGA672
Part Image EP1S20F672I7ES Intel Corporation

Field Programmable Gate Array, 1846 CLBS, CMOS, PBGA672
For a full list of alternate parts for EP1S20F672C7, check out Findchips.com