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EP2AGX65DF25I5N - Intel

Description: IC FPGA 252 I/O 572FBGA

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EP2AGX65DF25I5N - Intel PCB footprint - BGA - BGA - 572-Pin FineLine Ball-Grid Array (FBGA) - Flip Chip - Lidless - A:2.20
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EP2AGX65DF25I5N - Intel  - 3D model - BGA - 572-Pin FineLine Ball-Grid Array (FBGA) - Flip Chip - Lidless - A:2.20
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EP2AGX65DF25I5N Details

  • Manufacturer Part Number:

    EP2AGX65DF25I5N

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    25 X 25 MM, LEAD FREE, MS-034, FBGA-572

  • HTS Code:

    8542.31.00.60

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    0

  • Clock Frequency-Max:

    500 MHz

  • JESD-30 Code:

    S-PBGA-B572

  • JESD-609 Code:

    e1

  • Length:

    25 mm

  • Moisture Sensitivity Level:

    3

  • Number of CLBs:

    2530

  • Number of Inputs:

    260

  • Number of Logic Cells:

    60214

  • Number of Outputs:

    260

  • Number of Terminals:

    572

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    2530 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HBGA

  • Package Equivalence Code:

    BGA572,24X24,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, HEAT SINK/SLUG

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2.2 mm

  • Supply Voltage-Max:

    0.93 V

  • Supply Voltage-Min:

    0.87 V

  • Supply Voltage-Nom:

    0.9 V

  • Surface Mount:

    YES

  • Technology:

    40 nm

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    25 mm

EP2AGX65DF25I5N Frequently Asked Questions (FAQs)

  • The maximum power consumption of EP2AGX65DF25I5N is around 25W, but it can vary depending on the specific use case and operating conditions. It's recommended to consult the Intel Power and Thermal Guidelines document for more detailed information.
  • The EP2AGX65DF25I5N has a DDR3 memory interface, but it requires specific configuration and timing settings. Intel provides a DDR3 Memory Interface User Guide that provides detailed information on how to implement and configure the DDR3 interface.
  • Yes, the EP2AGX65DF25I5N is designed for high-reliability applications, such as aerospace, defense, and industrial control systems. It meets the requirements of various industry standards, including DO-254 and IEC 61508. However, it's essential to follow Intel's guidelines and recommendations for designing and testing high-reliability systems.
  • Optimizing the performance of EP2AGX65DF25I5N requires a combination of hardware and software techniques. Intel provides a range of optimization tools and guidelines, including the Intel FPGA SDK for OpenCL, the Intel Quartus Prime Pro software, and the Intel FPGA Performance Optimization Guide.
  • Yes, the EP2AGX65DF25I5N is compatible with various operating systems, including Linux, Windows, and VxWorks. Intel provides a range of software development tools and drivers to support these operating systems, including the Intel FPGA SDK for OpenCL and the Intel SoC FPGA Embedded Development Suite.

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