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EP2SGX30CF780C5N - Intel

Description: FPGA, STRATIX II GX

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EP2SGX30CF780C5N - Intel - PCB symbol
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PCB Footprints
EP2SGX30CF780C5N - Intel PCB footprint - BGA - BGA - 780-Pin FineLine Ball-Grid Array (FBGA)
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3D Models
EP2SGX30CF780C5N - Intel - 3D model - BGA - 780-Pin FineLine Ball-Grid Array (FBGA)
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EP2SGX30CF780C5N Details

  • Manufacturer Part Number:

    EP2SGX30CF780C5N

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    29 X 29 MM, 1 MM PITCH, LEAD FREE, MS-034AAM-1, FBGA-780

  • HTS Code:

    8542.31.00.60

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    0

  • Clock Frequency-Max:

    640 MHz

  • Combinatorial Delay of a CLB-Max:

    5.962 ns

  • JESD-30 Code:

    S-PBGA-B780

  • JESD-609 Code:

    e1

  • Length:

    29 mm

  • Moisture Sensitivity Level:

    3

  • Number of CLBs:

    33880

  • Number of Inputs:

    361

  • Number of Logic Cells:

    33880

  • Number of Outputs:

    361

  • Number of Terminals:

    780

  • Operating Temperature-Max:

    85 °C

  • Organization:

    33880 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA780,28X28,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    3.5 mm

  • Supply Voltage-Max:

    1.25 V

  • Supply Voltage-Min:

    1.15 V

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Technology:

    CMOS, 90 nm

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    29 mm

EP2SGX30CF780C5N Frequently Asked Questions (FAQs)

  • The maximum power consumption of EP2SGX30CF780C5N is 12W, but it can vary depending on the specific use case and operating conditions.
  • To optimize the performance of EP2SGX30CF780C5N, ensure proper cooling, use the optimal clock frequency, and optimize the design for parallel processing. Additionally, use Intel's development tools and software development kits (SDKs) to optimize the design.
  • The maximum operating temperature of EP2SGX30CF780C5N is 100°C (212°F), but it's recommended to operate within a temperature range of 0°C to 85°C (32°F to 185°F) for optimal performance and reliability.
  • Yes, EP2SGX30CF780C5N is suitable for high-reliability applications, such as aerospace, defense, and industrial control systems, due to its rugged design and ability to operate in harsh environments.
  • To ensure the security of your design using EP2SGX30CF780C5N, implement secure boot mechanisms, use encryption and secure communication protocols, and follow Intel's security guidelines and recommendations.

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EP2SGX30CF780C5N Overview

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EP2SGX30CF780C5N Alternates

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Part Image EP2SGX30CF780C5N Altera Corporation

Field Programmable Gate Array, 33880 CLBs, 640MHz, 33880-Cell, CMOS, PBGA780
Part Image EP2SGX30CF780C5 Altera Corporation

Field Programmable Gate Array, 33880 CLBs, 640MHz, 33880-Cell, CMOS, PBGA780
Part Image EP2SGX30CF780I5N Intel Corporation

Field Programmable Gate Array, 33880 CLBs, 622.08MHz, 33380-Cell, CMOS, PBGA780
Part Image EP2SGX30CF780I5 Intel Corporation

Field Programmable Gate Array, 33880 CLBs, 622.08MHz, 33380-Cell, CMOS, PBGA780