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EP2SGX60CF780C5N - Intel

Description: FPGA, STRATIX II GX

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EP2SGX60CF780C5N - Intel PCB footprint - BGA - BGA - 780-Pin FineLine Ball-Grid Array (FBGA)
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3D Models
EP2SGX60CF780C5N - Intel  - 3D model - BGA - 780-Pin FineLine Ball-Grid Array (FBGA)
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EP2SGX60CF780C5N Details

  • Manufacturer Part Number:

    EP2SGX60CF780C5N

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    29 X 29 MM, 1 MM PITCH, LEAD FREE, MS-034AAM-1, FBGA-780

  • HTS Code:

    8542.31.00.60

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    0

  • Clock Frequency-Max:

    640 MHz

  • Combinatorial Delay of a CLB-Max:

    5.962 ns

  • JESD-30 Code:

    S-PBGA-B780

  • JESD-609 Code:

    e1

  • Length:

    29 mm

  • Moisture Sensitivity Level:

    3

  • Number of CLBs:

    60440

  • Number of Inputs:

    364

  • Number of Logic Cells:

    60440

  • Number of Outputs:

    364

  • Number of Terminals:

    780

  • Operating Temperature-Max:

    85 °C

  • Organization:

    60440 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA780,28X28,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    3.5 mm

  • Supply Voltage-Max:

    1.25 V

  • Supply Voltage-Min:

    1.15 V

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Technology:

    CMOS, 90 nm

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    29 mm

EP2SGX60CF780C5N Frequently Asked Questions (FAQs)

  • The maximum power consumption of EP2SGX60CF780C5N is 12W, but it can vary depending on the operating frequency, voltage, and usage.
  • To optimize the performance of EP2SGX60CF780C5N, ensure proper cooling, use the optimal clock frequency, and optimize the design for parallel processing. Additionally, use Intel's development tools and IP cores to optimize the design.
  • The maximum operating temperature of EP2SGX60CF780C5N is 100°C (212°F), but it's recommended to operate it at a temperature below 85°C (185°F) for optimal performance and reliability.
  • Yes, EP2SGX60CF780C5N is suitable for high-reliability applications, such as aerospace, defense, and industrial control systems, due to its high-performance and low-power consumption features.
  • To ensure the security of your design using EP2SGX60CF780C5N, implement secure boot mechanisms, use encryption and secure communication protocols, and follow Intel's security guidelines and recommendations.

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EP2SGX60CF780C5N Overview

Use the download button to access the EP2SGX60CF780C5N schematic symbol, PCB footprint, and 3D model.
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EP2SGX60CF780C5N Alternates

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Image Part Number Model
Part Image EP2SGX60CF780C5N Altera Corporation

Field Programmable Gate Array, 60440 CLBs, 640MHz, 60440-Cell, CMOS, PBGA780

Part Image EP2SGX60CF780I5N Intel Corporation

Field Programmable Gate Array, 60440 CLBs, 622.08MHz, 60440-Cell, CMOS, PBGA780

Part Image EP2SGX60CF780C5 Altera Corporation

Field Programmable Gate Array, 60440 CLBs, 640MHz, 60440-Cell, CMOS, PBGA780

Part Image EP2SGX60CF780I5 Intel Corporation

Field Programmable Gate Array, 60440 CLBs, 622.08MHz, 60440-Cell, CMOS, PBGA780

Part Image EP2SGX60CF780I5 Altera Corporation

Field Programmable Gate Array, 60440 CLBs, 622.08MHz, 60440-Cell, CMOS, PBGA780

For a full list of alternate parts for EP2SGX60CF780C5N, check out Findchips.com