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EP2SGX60DF780C5N - Intel

Description: FPGA, STRATIX II GX

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EP2SGX60DF780C5N - Intel - PCB symbol
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PCB Footprints
EP2SGX60DF780C5N - Intel PCB footprint - BGA - BGA - 780-Pin FineLine Ball-Grid Array (FBGA)
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3D Models
EP2SGX60DF780C5N - Intel - 3D model - BGA - 780-Pin FineLine Ball-Grid Array (FBGA)
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EP2SGX60DF780C5N Details

  • Manufacturer Part Number:

    EP2SGX60DF780C5N

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    29 X 29 MM, 1 MM PITCH, LEAD FREE, MS-034AAM-1, FBGA-780

  • HTS Code:

    8542.31.00.60

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    0

  • Clock Frequency-Max:

    640 MHz

  • Combinatorial Delay of a CLB-Max:

    5.962 ns

  • JESD-30 Code:

    S-PBGA-B780

  • JESD-609 Code:

    e1

  • Length:

    29 mm

  • Moisture Sensitivity Level:

    3

  • Number of CLBs:

    60440

  • Number of Inputs:

    364

  • Number of Logic Cells:

    60440

  • Number of Outputs:

    364

  • Number of Terminals:

    780

  • Operating Temperature-Max:

    85 °C

  • Organization:

    60440 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA780,28X28,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    3.5 mm

  • Supply Voltage-Max:

    1.25 V

  • Supply Voltage-Min:

    1.15 V

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Technology:

    CMOS, 90 nm

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    29 mm

EP2SGX60DF780C5N Frequently Asked Questions (FAQs)

  • The maximum power consumption of EP2SGX60DF780C5N is around 12W, but it can vary depending on the specific use case and operating conditions.
  • To optimize the performance of EP2SGX60DF780C5N, you can use Intel's Quartus Prime software to optimize the design, reduce power consumption, and improve thermal performance. Additionally, you can also use Intel's Power Analyzer tool to analyze and optimize power consumption.
  • The maximum operating temperature of EP2SGX60DF780C5N is 100°C, but it's recommended to operate it within a temperature range of 0°C to 85°C for optimal performance and reliability.
  • Yes, EP2SGX60DF780C5N is suitable for high-reliability applications, such as aerospace, defense, and industrial control systems, due to its rugged design and ability to operate in harsh environments.
  • To ensure the security of your design using EP2SGX60DF780C5N, you can use Intel's security features such as Secure Boot, Secure Key Storage, and Encryption. Additionally, you can also implement your own security protocols and measures to protect your design.

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EP2SGX60DF780C5N Overview

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EP2SGX60DF780C5N Alternates

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Part Image EP2SGX60DF780C5 Intel Corporation

Field Programmable Gate Array, 60440 CLBs, 640MHz, 60440-Cell, CMOS, PBGA780
Part Image EP2SGX60DF780I5N Altera Corporation

Field Programmable Gate Array, 60440 CLBs, 622.08MHz, 60440-Cell, CMOS, PBGA780