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EP2SGX60EF1152C4N - Intel

Description: FPGA Stratix® II GX Family 60440 Cells 732.1MHz 90nm Technology 1.2V 1152-Pin FC-FBGA

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EP2SGX60EF1152C4N - Intel PCB footprint - BGA - BGA - 1152-Pin FBGA - Flip Chip - Flat Top SPL - A:3.50
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EP2SGX60EF1152C4N - Intel  - 3D model - BGA - 1152-Pin FBGA - Flip Chip - Flat Top SPL - A:3.50
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EP2SGX60EF1152C4N Details

  • Manufacturer Part Number:

    EP2SGX60EF1152C4N

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    LEAD FREE, MS-034AAR-1, FBGA-1152

  • HTS Code:

    8542.31.00.60

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    0

  • Clock Frequency-Max:

    717 MHz

  • Combinatorial Delay of a CLB-Max:

    5.117 ns

  • JESD-30 Code:

    S-PBGA-B1152

  • JESD-609 Code:

    e1

  • Length:

    35 mm

  • Moisture Sensitivity Level:

    3

  • Number of CLBs:

    60440

  • Number of Inputs:

    534

  • Number of Logic Cells:

    60440

  • Number of Outputs:

    534

  • Number of Terminals:

    1152

  • Operating Temperature-Max:

    85 °C

  • Organization:

    60440 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA1152,34X34,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    3.5 mm

  • Supply Voltage-Max:

    1.25 V

  • Supply Voltage-Min:

    1.15 V

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Technology:

    CMOS, 90 nm

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    35 mm

EP2SGX60EF1152C4N Frequently Asked Questions (FAQs)

  • The maximum power consumption of EP2SGX60EF1152C4N is 12W, but it can vary depending on the usage and configuration.
  • To optimize the performance of EP2SGX60EF1152C4N, ensure proper cooling, use the optimal clock frequency, and optimize the design for parallel processing.
  • The maximum operating temperature of EP2SGX60EF1152C4N is 100°C (212°F), but it's recommended to operate it at a temperature below 85°C (185°F) for optimal performance and reliability.
  • Yes, EP2SGX60EF1152C4N is suitable for high-reliability applications, such as aerospace, defense, and industrial control systems, due to its rugged design and error correction capabilities.
  • To ensure the security of your design using EP2SGX60EF1152C4N, implement secure boot mechanisms, use encryption, and follow Intel's security guidelines and recommendations.

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EP2SGX60EF1152C4N Overview

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EP2SGX60EF1152C4N Alternates

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Image Part Number Model
Part Image EP2SGX60EF1152I4 Altera Corporation

Field Programmable Gate Array, 60440 CLBs, 717MHz, 60440-Cell, CMOS, PBGA1152

Part Image EP2SGX60EF1152C4 Altera Corporation

Field Programmable Gate Array, 60440 CLBs, 717MHz, 60440-Cell, CMOS, PBGA1152

Part Image EP2SGX60EF1152C4N Altera Corporation

Field Programmable Gate Array, 60440 CLBs, 717MHz, 60440-Cell, CMOS, PBGA1152

Part Image EP2SGX60EF1152C4 Intel Corporation

Field Programmable Gate Array, 60440 CLBs, 717MHz, 60440-Cell, CMOS, PBGA1152

Part Image EP2SGX60EF1152I4N Intel Corporation

Field Programmable Gate Array, 60440 CLBs, 717MHz, 60440-Cell, CMOS, PBGA1152

For a full list of alternate parts for EP2SGX60EF1152C4N, check out Findchips.com