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EP3C120F484I7 - Intel

Description: series Field Programmable Gate Array (FPGA) IC 283 3981312 119088 484-BGA

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EP3C120F484I7 - Intel PCB footprint - BGA - BGA - 484-Pin FineLine Ball-Grid Array (FBGA) - Wire Bond - A:2.40
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3D Models
EP3C120F484I7 - Intel  - 3D model - BGA - 484-Pin FineLine Ball-Grid Array (FBGA) - Wire Bond - A:2.40
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EP3C120F484I7 Details

  • Manufacturer Part Number:

    EP3C120F484I7

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    23 X 23 MM, 1 MM PITCH, FBGA-484

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan, USA, Vietnam

  • HTS Code:

    8542.31.00.60

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    10

  • Clock Frequency-Max:

    472.5 MHz

  • JESD-30 Code:

    S-PBGA-B484

  • JESD-609 Code:

    e0

  • Length:

    23 mm

  • Moisture Sensitivity Level:

    3

  • Number of CLBs:

    119088

  • Number of Inputs:

    283

  • Number of Logic Cells:

    119088

  • Number of Outputs:

    283

  • Number of Terminals:

    484

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    119088 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA484,22X22,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    220

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2.4 mm

  • Supply Voltage-Max:

    1.25 V

  • Supply Voltage-Min:

    1.15 V

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Lead (Sn63Pb37)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    20

  • Width:

    23 mm

EP3C120F484I7 Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the EP3C120F484I7 is -40°C to 100°C.
  • To implement a CDC in the EP3C120F484I7, use a synchronizer circuit or a FIFO-based CDC to ensure data integrity and prevent metastability issues.
  • The maximum frequency supported by the EP3C120F484I7 is 500 MHz.
  • To optimize power consumption in the EP3C120F484I7, use power-aware design techniques such as clock gating, voltage scaling, and dynamic voltage and frequency scaling.
  • The EP3C120F484I7 has a total of 119,088 logic elements (LEs) available.

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EP3C120F484I7 Overview

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EP3C120F484I7 Alternates

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Image Part Number Model
Part Image EP3C120F484C7 Altera Corporation

Field Programmable Gate Array, 119088 CLBs, 472.5MHz, 119088-Cell, CMOS, PBGA484

Part Image EP3C120F484C7N Intel Corporation

Field Programmable Gate Array, 119088 CLBs, 472.5MHz, 119088-Cell, CMOS, PBGA484

Part Image EP3C120F484C7 Intel Corporation

Field Programmable Gate Array, 119088 CLBs, 472.5MHz, 119088-Cell, CMOS, PBGA484

Part Image EP3C120F484C7NES Altera Corporation

Field Programmable Gate Array, 119088 CLBs, 472.5MHz, PBGA484

Part Image EP3C120F484C7ES Altera Corporation

Field Programmable Gate Array, 119088 CLBs, 472.5MHz, PBGA484

For a full list of alternate parts for EP3C120F484I7, check out Findchips.com