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EP3C25E144C8N - Intel

Description: FPGA Cyclone® III Family 24624 Cells 402MHz 65nm Technology 1.2V 144-Pin EQFP EP

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EP3C25E144C8N - Intel PCB footprint - Quad Flat Packages - Quad Flat Packages - 144-Pin Plastic Enhanced Quad Flat Pack (EQFP) - Wire Bond - A:1.65 - D2:4.00
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EP3C25E144C8N - Intel  - 3D model - Quad Flat Packages - 144-Pin Plastic Enhanced Quad Flat Pack (EQFP) - Wire Bond - A:1.65 - D2:4.00
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  • Datasheet Download Datasheet
  • Stock & Prices $ Price & Stock for EP3C25E144C8N
  • Part Number EP3C25E144C8N
  • Manufacturer Intel
  • Pin Count 145
  • Part Category Integrated Circuit
  • Package Category Quad Flat Packages
  • Footprint Name Quad Flat Packages - 144-Pin Plastic Enhanced Quad Flat Pack (EQFP) - Wire Bond - A:1.65 - D2:4.00
  • Released Date Nov 21, 2019
  • Last Modified Date Mar 7, 2023 4:10 PM UTC
  • Pinout / Pin List Click Here (Member Only)

EP3C25E144C8N Details

  • Manufacturer Part Number:

    EP3C25E144C8N

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    22 X 22 MM, 1.60 MM HEIGHT, 0.50 MM PITCH, PLASTIC, LEAD FREE, EQFP-144

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan, USA, Vietnam

  • HTS Code:

    8542.31.00.60

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    10

  • Clock Frequency-Max:

    472.5 MHz

  • JESD-30 Code:

    R-PQFP-G144

  • JESD-609 Code:

    e3

  • Length:

    20 mm

  • Moisture Sensitivity Level:

    3

  • Number of CLBs:

    24624

  • Number of Inputs:

    82

  • Number of Logic Cells:

    24624

  • Number of Outputs:

    82

  • Number of Terminals:

    144

  • Operating Temperature-Max:

    85 °C

  • Organization:

    24624 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFQFP

  • Package Equivalence Code:

    QFP144,.87SQ,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.6 mm

  • Supply Voltage-Max:

    1.25 V

  • Supply Voltage-Min:

    1.15 V

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Width:

    20 mm

EP3C25E144C8N Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the EP3C25E144C8N is -40°C to 100°C.
  • To implement a clock domain crossing (CDC) in the EP3C25E144C8N, you can use a synchronizer circuit or a FIFO-based CDC. The synchronizer circuit uses a pair of flip-flops to resynchronize the signal, while the FIFO-based CDC uses a first-in-first-out (FIFO) buffer to transfer data between clock domains.
  • The maximum frequency of the EP3C25E144C8N is 260 MHz.
  • To optimize the power consumption of the EP3C25E144C8N, you can use power-aware design techniques such as clock gating, voltage scaling, and dynamic voltage and frequency scaling (DVFS). You can also use the Intel Quartus II software to optimize power consumption during the design process.
  • The maximum current rating of the EP3C25E144C8N is 1.5 A.

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EP3C25E144C8N Overview

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Part Image EP3C25E144C8N Altera Corporation

Field Programmable Gate Array, 24624 CLBs, 472.5MHz, 24624-Cell, CMOS, PQFP144

Part Image EP3C25E144C8 Altera Corporation

Field Programmable Gate Array, 24624 CLBs, 472.5MHz, 24624-Cell, CMOS, PQFP144

Part Image EP3C25E144C8 Intel Corporation

Field Programmable Gate Array, 24624 CLBs, 472.5MHz, 24624-Cell, CMOS, PQFP144

Part Image EP3C25E144C8NES Altera Corporation

Field Programmable Gate Array, 24624 CLBs, 472.5MHz, PQFP144