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EP3C55U484I7N - Intel

Description: FPGA Cyclone® III Family 55856 Cells 437.5MHz 65nm Technology 1.2V 484-Pin UFBGA

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EP3C55U484I7N - Intel PCB footprint - BGA - BGA - 484-Pin Ultra FineLine Ball-Grid Array (UBGA) - Wire Bond -A:2.05
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EP3C55U484I7N - Intel  - 3D model - BGA - 484-Pin Ultra FineLine Ball-Grid Array (UBGA) - Wire Bond -A:2.05
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EP3C55U484I7N Details

  • Manufacturer Part Number:

    EP3C55U484I7N

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    19 X 19 MM, 2.20 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, UFBGA-484

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan, USA, Vietnam

  • ECCN Code:

    3A991

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    10

  • Clock Frequency-Max:

    472.5 MHz

  • JESD-30 Code:

    R-PBGA-B484

  • JESD-609 Code:

    e1

  • Length:

    19 mm

  • Moisture Sensitivity Level:

    3

  • Number of CLBs:

    55856

  • Number of Inputs:

    327

  • Number of Logic Cells:

    55856

  • Number of Outputs:

    327

  • Number of Terminals:

    484

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    55856 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    FBGA

  • Package Equivalence Code:

    BGA484,22X22,32

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, FINE PITCH

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2.2 mm

  • Supply Voltage-Max:

    1.25 V

  • Supply Voltage-Min:

    1.15 V

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Width:

    19 mm

EP3C55U484I7N Frequently Asked Questions (FAQs)

  • The EP3C55U484I7N has an industrial temperature range of -40°C to 100°C, making it suitable for use in harsh environments.
  • To implement a CDC in the EP3C55U484I7N, use the Intel FPGA IP Catalog to generate a CDC module, or use a synchronizer circuit with a FIFO or a gray counter to transfer data between clock domains.
  • The maximum frequency achievable with the EP3C55U484I7N depends on the specific design and implementation, but Intel claims a maximum clock frequency of up to 500 MHz for this device.
  • To optimize power consumption, use the Intel Quartus II Power Analyzer to identify power-hungry components, and apply power-saving techniques such as clock gating, voltage scaling, and dynamic voltage and frequency scaling.
  • Yes, the EP3C55U484I7N is suitable for high-reliability applications, such as aerospace, defense, and industrial control systems, due to its high reliability and fault-tolerant features.

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EP3C55U484I7N Overview

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Image Part Number Model
Part Image EP3C55U484C7N Intel Corporation

Field Programmable Gate Array, 55856 CLBs, 472.5MHz, 55856-Cell, CMOS, PBGA484

Part Image EP3C55U484I7N Altera Corporation

Field Programmable Gate Array, 55856 CLBs, 472.5MHz, 55856-Cell, CMOS, PBGA484

Part Image EP3C55U484C7 Altera Corporation

Field Programmable Gate Array, 55856 CLBs, 472.5MHz, 55856-Cell, CMOS, PBGA484

Part Image EP3C55U484I7 Altera Corporation

Field Programmable Gate Array, 55856 CLBs, 472.5MHz, 55856-Cell, CMOS, PBGA484

Part Image EP3C55U484C7N Altera Corporation

Field Programmable Gate Array, 55856 CLBs, 472.5MHz, 55856-Cell, CMOS, PBGA484

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