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EP4CE10E22C9LN - Intel

Description: FPGA - Field Programmable Gate Array FPGA - Cyclone IV E 645 LABs 91 IOs

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PCB Footprints
EP4CE10E22C9LN - Intel PCB footprint - Quad Flat Packages - Quad Flat Packages - 144-Pin Plastic Enhanced Quad Flat Pack (EQFP) - Wire Bond - A:1.65 - D2:5.4
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3D Models
EP4CE10E22C9LN - Intel  - 3D model - Quad Flat Packages - 144-Pin Plastic Enhanced Quad Flat Pack (EQFP) - Wire Bond - A:1.65 - D2:5.4
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  • Datasheet Download Datasheet
  • Stock & Prices $ Price & Stock for EP4CE10E22C9LN
  • Part Number EP4CE10E22C9LN
  • Manufacturer Intel
  • Pin Count 144
  • Part Category Integrated Circuit
  • Package Category Quad Flat Packages
  • Footprint Name Quad Flat Packages - 144-Pin Plastic Enhanced Quad Flat Pack (EQFP) - Wire Bond - A:1.65 - D2:5.4
  • Released Date Apr 10, 2017
  • Last Modified Date Mar 7, 2023 4:10 PM UTC
  • Pinout / Pin List Click Here (Member Only)

EP4CE10E22C9LN Details

  • Manufacturer Part Number:

    EP4CE10E22C9LN

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    22 X 22 MM, 0.50 MM PITCH, LEAD FREE, EQFP-144

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan, USA, Vietnam

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    7

  • Clock Frequency-Max:

    265 MHz

  • JESD-30 Code:

    S-PQFP-G144

  • JESD-609 Code:

    e3

  • Length:

    20 mm

  • Moisture Sensitivity Level:

    3

  • Number of CLBs:

    645

  • Number of Inputs:

    91

  • Number of Logic Cells:

    10320

  • Number of Outputs:

    91

  • Number of Terminals:

    144

  • Operating Temperature-Max:

    85 °C

  • Organization:

    645 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HLFQFP

  • Package Equivalence Code:

    QFP144,.87SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.65 mm

  • Supply Voltage-Max:

    1.03 V

  • Supply Voltage-Min:

    0.97 V

  • Supply Voltage-Nom:

    1 V

  • Surface Mount:

    YES

  • Technology:

    60 nm

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Width:

    20 mm

EP4CE10E22C9LN Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for EP4CE10E22C9LN is -40°C to 100°C.
  • To implement a clock domain crossing (CDC) in EP4CE10E22C9LN, you can use Intel's recommended CDC techniques, such as using synchronizers, FIFOs, or handshake signals. You can also use the built-in CDC IP cores provided by Intel.
  • The maximum frequency that EP4CE10E22C9LN can operate at is 500 MHz.
  • To optimize power consumption in EP4CE10E22C9LN, you can use Intel's PowerPlay power management technology, which allows you to dynamically adjust the power consumption of the device based on the system's requirements. You can also use power-saving features such as clock gating, voltage scaling, and dynamic voltage and frequency scaling.
  • The maximum amount of memory that EP4CE10E22C9LN can access is 16 Mbits of RAM and 16 Mbits of ROM.

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