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EP4CE10F17C6 - Intel

Description: Cyclone® IV E Field Programmable Gate Array (FPGA) IC 179 423936 10320 256-LBGA 1.15V ~ 1.25V ,0°C ~ 85°C (TJ)

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EP4CE10F17C6 - Intel PCB footprint - BGA - BGA - 256-Pin FineLine Ball-Grid Array (FBGA) - THIN - Wire Bond-A:1.55
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EP4CE10F17C6 - Intel  - 3D model - BGA - 256-Pin FineLine Ball-Grid Array (FBGA) - THIN - Wire Bond-A:1.55
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EP4CE10F17C6 Details

  • Manufacturer Part Number:

    EP4CE10F17C6

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    17 X 17 MM, 1 MM PITCH, FBGA-256

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan, USA, Vietnam

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    5

  • Clock Frequency-Max:

    472.5 MHz

  • JESD-30 Code:

    S-PBGA-B256

  • JESD-609 Code:

    e0

  • Length:

    17 mm

  • Moisture Sensitivity Level:

    3

  • Number of CLBs:

    645

  • Number of Inputs:

    179

  • Number of Logic Cells:

    10320

  • Number of Outputs:

    179

  • Number of Terminals:

    256

  • Operating Temperature-Max:

    85 °C

  • Organization:

    645 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LBGA

  • Package Equivalence Code:

    BGA256,16X16,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.55 mm

  • Supply Voltage-Max:

    1.25 V

  • Supply Voltage-Min:

    1.15 V

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Technology:

    60 nm

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Tin/Lead (Sn/Pb)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    17 mm

EP4CE10F17C6 Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for EP4CE10F17C6 is -40°C to 100°C (industrial grade) and -40°C to 85°C (commercial grade).
  • To implement a clock domain crossing (CDC) in EP4CE10F17C6, you can use Intel's recommended CDC techniques, such as using synchronizers, FIFOs, or handshake signals to transfer data between clock domains.
  • The maximum frequency supported by EP4CE10F17C6 is 500 MHz, but it depends on the specific application and design requirements.
  • To optimize power consumption in EP4CE10F17C6, you can use Intel's PowerPlay power management technology, which allows you to dynamically adjust power consumption based on system requirements. Additionally, you can use low-power modes, clock gating, and other power-saving techniques.
  • The EP4CE10F17C6 has a total of 10,320 logic elements (LEs) available for use in your design.

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EP4CE10F17C6 Overview

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Part Image EP4CE10F17C6N Intel Corporation

Field Programmable Gate Array, 645 CLBs, 472.5MHz, 10320-Cell, PBGA256