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EP4CE115F29I7N - Intel

Description: FPGA Cyclone® IV E Family 114480 Cells 60nm Technology 1V/1.2V 780-Pin FBGA

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EP4CE115F29I7N - Intel PCB footprint - BGA - BGA - 780-Pin FineLine Ball-Grid Array (FBGA) - Wire Bond - A:2.40
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EP4CE115F29I7N - Intel  - 3D model - BGA - 780-Pin FineLine Ball-Grid Array (FBGA) - Wire Bond - A:2.40
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EP4CE115F29I7N Details

  • Manufacturer Part Number:

    EP4CE115F29I7N

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    29 X 29 MM, 1 MM PITCH, LEAD FREE, FBGA-780

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan, USA, Vietnam

  • ECCN Code:

    3A991

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    7

  • Clock Frequency-Max:

    472.5 MHz

  • JESD-30 Code:

    S-PBGA-B780

  • JESD-609 Code:

    e1

  • Length:

    29 mm

  • Moisture Sensitivity Level:

    3

  • Number of CLBs:

    7155

  • Number of Inputs:

    531

  • Number of Logic Cells:

    114480

  • Number of Outputs:

    531

  • Number of Terminals:

    780

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    7155 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA780,28X28,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2.4 mm

  • Supply Voltage-Max:

    1.25 V

  • Supply Voltage-Min:

    1.15 V

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Technology:

    60 nm

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    29 mm

EP4CE115F29I7N Frequently Asked Questions (FAQs)

  • The EP4CE115F29I7N has an operating temperature range of -40°C to 100°C.
  • Intel provides guidelines for CDC implementation in their documentation. It's recommended to use synchronous clock domains and use Intel's IP cores for CDC.
  • The power consumption of the EP4CE115F29I7N varies depending on the design and usage. However, Intel provides power estimation tools to help estimate power consumption.
  • Yes, the EP4CE115F29I7N is suitable for high-reliability applications. It has features like error correction and single-event upset (SEU) mitigation.
  • Optimization techniques include pipelining, parallel processing, and using Intel's IP cores. Additionally, Intel provides optimization tools and guidelines in their documentation.

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EP4CE115F29I7N Overview

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Image Part Number Model
Part Image EP4CE115F29I7 Altera Corporation

Field Programmable Gate Array, 7155 CLBs, 472.5MHz, 114480-Cell, PBGA780

Part Image EP4CE115F29C7 Intel Corporation

Field Programmable Gate Array, 7155 CLBs, 472.5MHz, 114480-Cell, PBGA780

Part Image EP4CE115F29I7 Intel Corporation

Field Programmable Gate Array, 7155 CLBs, 472.5MHz, 114480-Cell, PBGA780