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EP4CE15E22I8LN - Intel

Description: FPGA - Field Programmable Gate Array FPGA - Cyclone IV E 963 LABs 81 IOs

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EP4CE15E22I8LN - Intel PCB footprint - Quad Flat Packages - Quad Flat Packages - 144-Pin Plastic Enhanced Quad Flat Pack (EQFP) - Wire Bond - A:1.65 - D2:4.00
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EP4CE15E22I8LN - Intel  - 3D model - Quad Flat Packages - 144-Pin Plastic Enhanced Quad Flat Pack (EQFP) - Wire Bond - A:1.65 - D2:4.00
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  • Datasheet Download Datasheet
  • Stock & Prices $ Price & Stock for EP4CE15E22I8LN
  • Part Number EP4CE15E22I8LN
  • Manufacturer Intel
  • Pin Count 145
  • Part Category Integrated Circuit
  • Package Category Quad Flat Packages
  • Footprint Name Quad Flat Packages - 144-Pin Plastic Enhanced Quad Flat Pack (EQFP) - Wire Bond - A:1.65 - D2:4.00
  • Released Date Feb 6, 2019
  • Last Modified Date Mar 7, 2023 4:10 PM UTC
  • Pinout / Pin List Click Here (Member Only)

EP4CE15E22I8LN Details

  • Manufacturer Part Number:

    EP4CE15E22I8LN

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    22 X 22 MM, 0.50 MM PITCH, LEAD FREE, EQFP-144

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan, USA, Vietnam

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    7

  • Clock Frequency-Max:

    362 MHz

  • JESD-30 Code:

    S-PQFP-G144

  • JESD-609 Code:

    e3

  • Length:

    20 mm

  • Moisture Sensitivity Level:

    3

  • Number of CLBs:

    963

  • Number of Inputs:

    81

  • Number of Logic Cells:

    15408

  • Number of Outputs:

    81

  • Number of Terminals:

    144

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    963 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HLFQFP

  • Package Equivalence Code:

    QFP144,.87SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.65 mm

  • Supply Voltage-Max:

    1.03 V

  • Supply Voltage-Min:

    0.97 V

  • Supply Voltage-Nom:

    1 V

  • Surface Mount:

    YES

  • Technology:

    60 nm

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Width:

    20 mm

EP4CE15E22I8LN Frequently Asked Questions (FAQs)

  • The EP4CE15E22I8LN has an industrial temperature range of -40°C to 100°C, making it suitable for use in a wide range of applications.
  • Intel provides a Clock Tree Synthesis (CTS) tool as part of the Quartus II software, which helps to implement and optimize clock trees in the EP4CE15E22I8LN FPGA.
  • The power consumption of the EP4CE15E22I8LN FPGA depends on the specific design and usage. However, Intel provides power estimation tools and guidelines to help estimate power consumption. Typically, the static power consumption is around 1-2 watts, and the dynamic power consumption depends on the clock frequency and toggle rate.
  • Yes, the EP4CE15E22I8LN FPGA has built-in transceivers that support high-speed serial interfaces like PCIe, SATA, and Gigabit Ethernet. However, the specific implementation and performance may require additional IP cores and design expertise.
  • Intel provides a range of debugging and testing tools, including the SignalTap II logic analyzer, the System Console, and the Quartus II software. These tools allow you to monitor and debug your design in real-time, as well as perform functional and timing verification.

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Part Image EP4CE15E22C8LN Intel Corporation

Field Programmable Gate Array, 963 CLBs, 362MHz, 15408-Cell, PQFP144