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EP4CE15F23I7N - Intel

Description: FPGA - Field Programmable Gate Array FPGA - Cyclone IV E 963 LABs 343 IOs

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EP4CE15F23I7N - Intel PCB footprint - BGA - BGA - 484-Pin FineLine Ball-Grid Array (FBGA) - Wire Bond - A:2.40
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3D Models
EP4CE15F23I7N - Intel  - 3D model - BGA - 484-Pin FineLine Ball-Grid Array (FBGA) - Wire Bond - A:2.40
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EP4CE15F23I7N Details

  • Manufacturer Part Number:

    EP4CE15F23I7N

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    23 X 23 MM, 1 MM PITCH, LEAD FREE, FBGA-484

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan, USA, Vietnam

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    7

  • Clock Frequency-Max:

    472.5 MHz

  • JESD-30 Code:

    S-PBGA-B484

  • JESD-609 Code:

    e1

  • Length:

    23 mm

  • Moisture Sensitivity Level:

    3

  • Number of CLBs:

    963

  • Number of Inputs:

    346

  • Number of Logic Cells:

    15408

  • Number of Outputs:

    346

  • Number of Terminals:

    484

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    963 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA484,22X22,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    260

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2.4 mm

  • Supply Voltage-Max:

    1.25 V

  • Supply Voltage-Min:

    1.15 V

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Technology:

    60 nm

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    23 mm

EP4CE15F23I7N Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the EP4CE15F23I7N is -40°C to 100°C.
  • To implement a clock domain crossing (CDC) in the EP4CE15F23I7N, you can use a synchronizer circuit or a FIFO-based CDC. The synchronizer circuit uses a pair of flip-flops to resynchronize the signal, while the FIFO-based CDC uses a FIFO to buffer the data and a clock domain crossing circuit to synchronize the clock.
  • The maximum frequency of the EP4CE15F23I7N is 500 MHz.
  • To optimize the power consumption of the EP4CE15F23I7N, you can use power-aware design techniques such as clock gating, voltage scaling, and dynamic voltage and frequency scaling. You can also use the Intel Quartus II software to optimize the power consumption of your design.
  • The maximum current consumption of the EP4CE15F23I7N is 1.1 A.

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EP4CE15F23I7N Overview

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EP4CE15F23I7N Alternates

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Image Part Number Model
Part Image EP4CE15F23C7N Altera Corporation

Field Programmable Gate Array, 963 CLBs, 472.5MHz, 15408-Cell, PBGA484

Part Image EP4CE15F23A7N Altera Corporation

Field Programmable Gate Array, 963 CLBs, 472.5MHz, 15408-Cell, PBGA484

Part Image EP4CE15F23C7N Intel Corporation

Field Programmable Gate Array, 963 CLBs, 472.5MHz, 15408-Cell, PBGA484

Part Image EP4CE15F23C7 Intel Corporation

Field Programmable Gate Array, 963 CLBs, 472.5MHz, 15408-Cell, PBGA484

Part Image EP4CE15F23A7N Intel Corporation

Field Programmable Gate Array, 963 CLBs, 472.5MHz, 15408-Cell, PBGA484

For a full list of alternate parts for EP4CE15F23I7N, check out Findchips.com