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EP4CE40F29I8LN - Intel

Description: FPGA - Field Programmable Gate Array FPGA - Cyclone IV E 2475 LABs 532 IOs

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EP4CE40F29I8LN - Intel PCB footprint - BGA - BGA - 780-Pin FineLine Ball-Grid Array (FBGA) - Wire Bond - A:2.40
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EP4CE40F29I8LN - Intel  - 3D model - BGA - 780-Pin FineLine Ball-Grid Array (FBGA) - Wire Bond - A:2.40
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EP4CE40F29I8LN Details

  • Manufacturer Part Number:

    EP4CE40F29I8LN

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    29 X 29 MM, 1 MM PITCH, LEAD FREE, FBGA-780

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan, USA, Vietnam

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    7

  • Clock Frequency-Max:

    362 MHz

  • JESD-30 Code:

    S-PBGA-B780

  • JESD-609 Code:

    e1

  • Length:

    29 mm

  • Moisture Sensitivity Level:

    3

  • Number of CLBs:

    2475

  • Number of Inputs:

    535

  • Number of Logic Cells:

    39600

  • Number of Outputs:

    535

  • Number of Terminals:

    780

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    2475 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA780,28X28,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2.4 mm

  • Supply Voltage-Max:

    1.03 V

  • Supply Voltage-Min:

    0.97 V

  • Supply Voltage-Nom:

    1 V

  • Surface Mount:

    YES

  • Technology:

    60 nm

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    29 mm

EP4CE40F29I8LN Frequently Asked Questions (FAQs)

  • The EP4CE40F29I8LN has an industrial temperature range of -40°C to 100°C, making it suitable for use in a wide range of environments.
  • To implement a CDC in the EP4CE40F29I8LN, you can use the FPGA's built-in clock domain crossing circuits, such as the CDC FIFO or the asynchronous FIFO. You can also use synchronization circuits, such as double-flop synchronization or gray code synchronization.
  • The maximum frequency achievable with the EP4CE40F29I8LN depends on the specific design and the clocking architecture used. However, Intel's Cyclone IV FPGA family, which includes the EP4CE40F29I8LN, can achieve clock frequencies of up to 500 MHz.
  • To optimize power consumption in your design, you can use various techniques such as clock gating, power gating, and dynamic voltage and frequency scaling. You can also use Intel's PowerPlay power analysis tool to identify areas of high power consumption and optimize your design accordingly.
  • The EP4CE40F29I8LN has a total of 2,280,000 bits of memory, which includes 240,000 bits of M9K memory blocks and 2,040,000 bits of MLAB memory blocks.

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EP4CE40F29I8LN Overview

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Part Image EP4CE40F29C8LN Intel Corporation

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Part Image EP4CE40F29I8L Intel Corporation

Field Programmable Gate Array, 2475 CLBs, 362MHz, 39600-Cell, PBGA780

Part Image EP4CE40F29I8LN Altera Corporation

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Part Image EP4CE40F29I8L Altera Corporation

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