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EP4CE6E22C8LN - Intel

Description: FPGA - Field Programmable Gate Array FPGA - Cyclone IV E 392 LABs 91 IOs

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EP4CE6E22C8LN - Intel PCB footprint - Quad Flat Packages - Quad Flat Packages - 144-Pin Plastic Enhanced Quad Flat Pack (EQFP) - Wire Bond - A:1.65 - D2:5.4
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EP4CE6E22C8LN - Intel  - 3D model - Quad Flat Packages - 144-Pin Plastic Enhanced Quad Flat Pack (EQFP) - Wire Bond - A:1.65 - D2:5.4
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  • Datasheet Download Datasheet
  • Stock & Prices $ Price & Stock for EP4CE6E22C8LN
  • Part Number EP4CE6E22C8LN
  • Manufacturer Intel
  • Pin Count 144
  • Part Category Integrated Circuit
  • Package Category Quad Flat Packages
  • Footprint Name Quad Flat Packages - 144-Pin Plastic Enhanced Quad Flat Pack (EQFP) - Wire Bond - A:1.65 - D2:5.4
  • Released Date Feb 26, 2020
  • Last Modified Date Mar 7, 2023 4:10 PM UTC
  • Pinout / Pin List Click Here (Member Only)

EP4CE6E22C8LN Details

  • Manufacturer Part Number:

    EP4CE6E22C8LN

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    22 X 22 MM, 0.50 MM PITCH, LEAD FREE, EQFP-144

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan, USA, Vietnam

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    7

  • Clock Frequency-Max:

    362 MHz

  • JESD-30 Code:

    S-PQFP-G144

  • JESD-609 Code:

    e3

  • Length:

    20 mm

  • Moisture Sensitivity Level:

    3

  • Number of CLBs:

    392

  • Number of Inputs:

    91

  • Number of Logic Cells:

    6272

  • Number of Outputs:

    91

  • Number of Terminals:

    144

  • Operating Temperature-Max:

    85 °C

  • Organization:

    392 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HLFQFP

  • Package Equivalence Code:

    QFP144,.87SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.65 mm

  • Supply Voltage-Max:

    1.03 V

  • Supply Voltage-Min:

    0.97 V

  • Supply Voltage-Nom:

    1 V

  • Surface Mount:

    YES

  • Technology:

    60 nm

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Width:

    20 mm

EP4CE6E22C8LN Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the EP4CE6E22C8LN is -40°C to 100°C.
  • To implement a clock domain crossing (CDC) in the EP4CE6E22C8LN, use a synchronizer circuit or a FIFO-based CDC to ensure data integrity and prevent metastability issues.
  • The maximum frequency supported by the EP4CE6E22C8LN is 500 MHz.
  • To optimize power consumption in the EP4CE6E22C8LN, use power-aware design techniques such as clock gating, voltage scaling, and dynamic voltage and frequency scaling.
  • The EP4CE6E22C8LN has a total of 6,272 logic elements (LEs) available.

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EP4CE6E22C8LN Overview

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Part Image EP4CE6E22I8L Altera Corporation

Field Programmable Gate Array, 392 CLBs, 362MHz, 6272-Cell, PQFP144

Part Image EP4CE6E22C8L Intel Corporation

Field Programmable Gate Array, 392 CLBs, 362MHz, 6272-Cell, PQFP144

Part Image EP4CE6E22I8L Intel Corporation

Field Programmable Gate Array, 392 CLBs, 362MHz, 6272-Cell, PQFP144