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EP4CE6F17I7N - Intel

Description: Cyclone® IV E Field Programmable Gate Array (FPGA) IC 179 276480 6272 256-LBGA

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EP4CE6F17I7N - Intel PCB footprint - BGA - BGA - 256-Pin FineLine Ball-Grid Array (FBGA) - THIN - Wire Bond - A:1.55
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EP4CE6F17I7N - Intel  - 3D model - BGA - 256-Pin FineLine Ball-Grid Array (FBGA) - THIN - Wire Bond - A:1.55
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EP4CE6F17I7N Details

  • Manufacturer Part Number:

    EP4CE6F17I7N

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    17 X 17 MM, 1 MM PITCH, LEAD FREE, FBGA-256

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan, USA, Vietnam

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    7

  • Clock Frequency-Max:

    472.5 MHz

  • JESD-30 Code:

    S-PBGA-B256

  • JESD-609 Code:

    e1

  • Length:

    17 mm

  • Moisture Sensitivity Level:

    3

  • Number of CLBs:

    392

  • Number of Inputs:

    179

  • Number of Logic Cells:

    6272

  • Number of Outputs:

    179

  • Number of Terminals:

    256

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    392 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA256,16X16,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    260

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2.2 mm

  • Supply Voltage-Max:

    1.25 V

  • Supply Voltage-Min:

    1.15 V

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Technology:

    60 nm

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    17 mm

EP4CE6F17I7N Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the EP4CE6F17I7N is -40°C to 100°C.
  • To implement a CDC in the EP4CE6F17I7N, use a synchronizer circuit or a FIFO-based CDC to ensure data integrity and prevent metastability issues.
  • The maximum frequency supported by the EP4CE6F17I7N is 500 MHz.
  • To optimize power consumption in the EP4CE6F17I7N, use power-aware design techniques such as clock gating, voltage scaling, and dynamic voltage and frequency scaling.
  • Yes, the EP4CE6F17I7N is suitable for high-reliability applications, such as aerospace, defense, and industrial control systems, due to its high reliability and fault tolerance features.

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EP4CE6F17I7N Overview

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EP4CE6F17I7N Alternates

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Image Part Number Model
Part Image EP4CE6F17C7N Altera Corporation

Field Programmable Gate Array, 392 CLBs, 472.5MHz, 6272-Cell, PBGA256

Part Image EP4CE6F17I7 Intel Corporation

Field Programmable Gate Array, 392 CLBs, 472.5MHz, 6272-Cell, PBGA256

Part Image EP4CE6F17A7N Altera Corporation

Field Programmable Gate Array, 392 CLBs, 472.5MHz, 6272-Cell, PBGA256

Part Image EP4CE6F17C7 Altera Corporation

Field Programmable Gate Array, 392 CLBs, 472.5MHz, 6272-Cell, PBGA256

Part Image EP4CE6F17I7 Altera Corporation

Field Programmable Gate Array, 392 CLBs, 472.5MHz, 6272-Cell, PBGA256

For a full list of alternate parts for EP4CE6F17I7N, check out Findchips.com