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EP4CGX110DF27C8N - Intel

Description: FPGA - Field Programmable Gate Array FPGA - Cyclone IV GX 6839 LABs 393 IOs

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EP4CGX110DF27C8N - Intel PCB footprint - BGA - BGA - 672-Pin FineLine Ball-Grid Array (FBGA)-
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EP4CGX110DF27C8N - Intel  - 3D model - BGA - 672-Pin FineLine Ball-Grid Array (FBGA)-
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EP4CGX110DF27C8N Details

  • Manufacturer Part Number:

    EP4CGX110DF27C8N

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    27 X 27 MM, 1 MM PITCH, LEAD FREE, FBGA-672

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan, USA, Vietnam

  • ECCN Code:

    3A991

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    7

  • Clock Frequency-Max:

    472.5 MHz

  • JESD-30 Code:

    S-PBGA-B672

  • JESD-609 Code:

    e1

  • Length:

    27 mm

  • Moisture Sensitivity Level:

    3

  • Number of CLBs:

    6839

  • Number of Inputs:

    393

  • Number of Logic Cells:

    109424

  • Number of Outputs:

    393

  • Number of Terminals:

    672

  • Operating Temperature-Max:

    85 °C

  • Organization:

    6839 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA672,26X26,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2.4 mm

  • Supply Voltage-Max:

    1.24 V

  • Supply Voltage-Min:

    1.16 V

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Technology:

    60 nm

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    27 mm

EP4CGX110DF27C8N Frequently Asked Questions (FAQs)

  • The maximum power consumption of EP4CGX110DF27C8N is approximately 12W, but it can vary depending on the specific use case and operating conditions.
  • To optimize the performance of EP4CGX110DF27C8N, ensure proper cooling, use the optimal clock frequency, and optimize the design to minimize power consumption. Additionally, use Intel's Quartus II software to optimize the FPGA design for performance.
  • The maximum operating temperature of EP4CGX110DF27C8N is 100°C (212°F), but it's recommended to operate within the commercial temperature range of 0°C to 85°C (32°F to 185°F) for optimal performance and reliability.
  • To ensure signal integrity in EP4CGX110DF27C8N designs, follow Intel's guidelines for signal routing, use differential signaling, and implement proper termination and shielding. Additionally, use simulation tools to analyze and optimize signal integrity.
  • The available development tools for EP4CGX110DF27C8N include Intel's Quartus II software, ModelSim-Altera simulation software, and the SoC Embedded Design Suite (EDS).

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EP4CGX110DF27C8N Overview

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Part Image EP4CGX110DF27C8 Intel Corporation

Field Programmable Gate Array, 6839 CLBs, 472.5MHz, 109424-Cell, PBGA672

Part Image EP4CGX110DF27C8 Altera Corporation

Field Programmable Gate Array, 6839 CLBs, 472.5MHz, 109424-Cell, PBGA672

Part Image EP4CGX110DF27C8N Altera Corporation

Field Programmable Gate Array, 6839 CLBs, 472.5MHz, 109424-Cell, PBGA672