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EP4CGX110DF31I7N - Intel

Description: FPGA - Field Programmable Gate Array

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EP4CGX110DF31I7N - Intel PCB footprint - BGA - BGA - 896-Pin FineLine Ball-Grid Array (FBGA) - Wire Bond - A:2.4
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EP4CGX110DF31I7N - Intel  - 3D model - BGA - 896-Pin FineLine Ball-Grid Array (FBGA) - Wire Bond - A:2.4
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EP4CGX110DF31I7N Details

  • Manufacturer Part Number:

    EP4CGX110DF31I7N

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    31 X 31 MM, 1 MM PITCH, LEAD FREE, FBGA-896

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan, USA, Vietnam

  • ECCN Code:

    3A991

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    7

  • Clock Frequency-Max:

    472.5 MHz

  • JESD-30 Code:

    S-PBGA-B896

  • JESD-609 Code:

    e1

  • Length:

    31 mm

  • Moisture Sensitivity Level:

    3

  • Number of CLBs:

    6839

  • Number of Inputs:

    475

  • Number of Logic Cells:

    109424

  • Number of Outputs:

    475

  • Number of Terminals:

    896

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    6839 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA896,30X30,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2.4 mm

  • Supply Voltage-Max:

    1.24 V

  • Supply Voltage-Min:

    1.16 V

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Technology:

    60 nm

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    31 mm

EP4CGX110DF31I7N Frequently Asked Questions (FAQs)

  • The maximum power consumption of EP4CGX110DF31I7N is approximately 25W, but it can vary depending on the specific use case and operating conditions.
  • To implement a reliable clocking scheme, use a high-quality clock source, such as a crystal oscillator or a phase-locked loop (PLL), and ensure that the clock signal is properly routed and terminated on the PCB.
  • For optimal performance and signal integrity, use a 4-6 layer PCB stackup with a dedicated power plane, and follow Intel's recommended PCB layout guidelines for the EP4CGX110DF31I7N.
  • To optimize thermal design, use a heat sink with a thermal interface material, ensure good airflow around the device, and follow Intel's thermal design guidelines for the EP4CGX110DF31I7N.
  • Use high-quality, low-ESR decoupling capacitors with a value of 0.01-0.1uF, placed as close as possible to the device's power pins, to ensure stable power supply and minimize noise.

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EP4CGX110DF31I7N Overview

Use the download button to access the EP4CGX110DF31I7N schematic symbol, PCB footprint, and 3D model.
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EP4CGX110DF31I7N Alternates

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Image Part Number Model
Part Image EP4CGX110DF31C7N Intel Corporation

Field Programmable Gate Array, 6839 CLBs, 472.5MHz, 109424-Cell, PBGA896

Part Image EP4CGX110DF31C7 Intel Corporation

Field Programmable Gate Array, 6839 CLBs, 472.5MHz, 109424-Cell, PBGA896

Part Image EP4CGX110DF31C7 Altera Corporation

Field Programmable Gate Array, 6839 CLBs, 472.5MHz, 109424-Cell, PBGA896

Part Image EP4CGX110DF31C7N Altera Corporation

Field Programmable Gate Array, 6839 CLBs, 472.5MHz, 109424-Cell, PBGA896

Part Image EP4CGX110DF31I7N Altera Corporation

Field Programmable Gate Array, 6839 CLBs, 472.5MHz, 109424-Cell, PBGA896

For a full list of alternate parts for EP4CGX110DF31I7N, check out Findchips.com