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EP4CGX150CF23I7N - Intel

Description: FPGA - Field Programmable Gate Array FPGA - Cyclone IV GX 9360 LABs 270 IOs

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EP4CGX150CF23I7N - Intel PCB footprint - BGA - BGA - 484-Pin FineLine Ball-Grid Array (FBGA) - Wire Bond - A:2.00_1
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EP4CGX150CF23I7N - Intel  - 3D model - BGA - 484-Pin FineLine Ball-Grid Array (FBGA) - Wire Bond - A:2.00_1
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EP4CGX150CF23I7N Details

  • Manufacturer Part Number:

    EP4CGX150CF23I7N

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    23 X 23 MM, 1 MM PITCH, LEAD FREE, FBGA-484

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan, USA, Vietnam

  • ECCN Code:

    3A991

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    7

  • Clock Frequency-Max:

    472.5 MHz

  • JESD-30 Code:

    S-PBGA-B484

  • JESD-609 Code:

    e1

  • Length:

    23 mm

  • Moisture Sensitivity Level:

    3

  • Number of CLBs:

    9360

  • Number of Inputs:

    270

  • Number of Logic Cells:

    149760

  • Number of Outputs:

    270

  • Number of Terminals:

    484

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    9360 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA484,22X22,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2.4 mm

  • Supply Voltage-Max:

    1.24 V

  • Supply Voltage-Min:

    1.16 V

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Technology:

    60 nm

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    23 mm

EP4CGX150CF23I7N Frequently Asked Questions (FAQs)

  • The maximum power consumption of EP4CGX150CF23I7N is 12W, but it can vary depending on the usage and configuration of the device.
  • To optimize the performance of EP4CGX150CF23I7N, you can use Intel's Quartus II software to optimize the design, use pipelining and parallel processing, and optimize the clock frequency and voltage.
  • The maximum clock frequency of EP4CGX150CF23I7N is 150 MHz, but it can be overclocked to higher frequencies with proper cooling and power management.
  • To implement DDR3 memory interface with EP4CGX150CF23I7N, you need to use the DDR3 PHY IP core from Intel, and follow the guidelines provided in the Intel FPGA DDR3 SDRAM Interface Specification.
  • The maximum temperature range for EP4CGX150CF23I7N is -40°C to 100°C, but it's recommended to operate the device within the commercial temperature range of 0°C to 85°C for optimal performance and reliability.

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EP4CGX150CF23I7N Overview

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Part Image EP4CGX150CF23C7N Altera Corporation

Field Programmable Gate Array, 9360 CLBs, 472.5MHz, 149760-Cell, PBGA484

Part Image EP4CGX150CF23C7 Intel Corporation

Field Programmable Gate Array, 9360 CLBs, 472.5MHz, 149760-Cell, PBGA484

Part Image EP4CGX150CF23C7 Altera Corporation

Field Programmable Gate Array, 9360 CLBs, 472.5MHz, 149760-Cell, PBGA484

Part Image EP4CGX150CF23I7 Altera Corporation

Field Programmable Gate Array, 9360 CLBs, 472.5MHz, 149760-Cell, PBGA484