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EP4CGX22CF19I7 - Intel

Description: FPGA Cyclone® IV GX Family 21280 Cells 60nm Technology 1.2V 324-Pin TFBGA

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EP4CGX22CF19I7 - Intel PCB footprint - BGA - BGA - 324-Pin FineLine Ball-Grid Array (FBGA) - THIN - Wire Bond - A:1.55
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EP4CGX22CF19I7 - Intel  - 3D model - BGA - 324-Pin FineLine Ball-Grid Array (FBGA) - THIN - Wire Bond - A:1.55
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EP4CGX22CF19I7 Details

  • Manufacturer Part Number:

    EP4CGX22CF19I7

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    19 X 19 MM, 1 MM PITCH, FBGA-324

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan, USA, Vietnam

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    5

  • Clock Frequency-Max:

    472.5 MHz

  • JESD-30 Code:

    S-PBGA-B324

  • JESD-609 Code:

    e0

  • Length:

    19 mm

  • Moisture Sensitivity Level:

    3

  • Number of CLBs:

    1330

  • Number of Inputs:

    150

  • Number of Logic Cells:

    21280

  • Number of Outputs:

    150

  • Number of Terminals:

    324

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    1330 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LBGA

  • Package Equivalence Code:

    BGA324,18X18,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.55 mm

  • Supply Voltage-Max:

    1.24 V

  • Supply Voltage-Min:

    1.16 V

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Technology:

    60 nm

  • Terminal Finish:

    Tin/Lead (Sn/Pb)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    19 mm

EP4CGX22CF19I7 Frequently Asked Questions (FAQs)

  • The maximum power consumption of EP4CGX22CF19I7 is approximately 2.5W, but it can vary depending on the specific use case and operating conditions.
  • To implement a reliable clocking scheme, you should use a high-quality clock source, such as a crystal oscillator or a phase-locked loop (PLL), and ensure that the clock signal is properly routed and terminated on the PCB. Additionally, you should follow Intel's guidelines for clocking and clock domain crossing.
  • To handle thermal management, you should ensure good airflow around the device, use a heat sink or thermal interface material (TIM) if necessary, and implement thermal monitoring and shutdown mechanisms to prevent overheating. You should also follow Intel's guidelines for thermal management and thermal design power (TDP).
  • To optimize the performance of EP4CGX22CF19I7, you should optimize your design for the specific use case, use the right synthesis and place-and-route tools, and follow Intel's guidelines for performance optimization. You should also consider using Intel's IP cores and optimized libraries.
  • The limitations of EP4CGX22CF19I7 in terms of signal integrity include the maximum frequency of operation, the number of transceivers, and the signal attenuation and distortion. You should follow Intel's guidelines for signal integrity and use simulation tools to analyze and optimize your design.

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EP4CGX22CF19I7 Overview

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EP4CGX22CF19I7 Alternates

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Image Part Number Model
Part Image EP4CGX22CF19C7N Altera Corporation

Field Programmable Gate Array, 1330 CLBs, 472.5MHz, 21280-Cell, PBGA324

Part Image EP4CGX22CF19I7N Intel Corporation

Field Programmable Gate Array, 1330 CLBs, 472.5MHz, 21280-Cell, PBGA324

Part Image EP4CGX22CF19C7 Intel Corporation

Field Programmable Gate Array, 1330 CLBs, 472.5MHz, 21280-Cell, PBGA324

Part Image EP4CGX22CF19I7 Altera Corporation

Field Programmable Gate Array, 1330 CLBs, 472.5MHz, 21280-Cell, PBGA324

Part Image EP4CGX22CF19C7 Altera Corporation

Field Programmable Gate Array, 1330 CLBs, 472.5MHz, 21280-Cell, PBGA324

For a full list of alternate parts for EP4CGX22CF19I7, check out Findchips.com