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EP4CGX30CF23C7N - Intel

Description: FPGA - Field Programmable Gate Array FPGA - Cyclone IV GX 1840 LABs 290 IOs

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PCB Footprints
EP4CGX30CF23C7N - Intel PCB footprint - BGA - BGA - 484-Pin FineLine Ball-Grid Array (FBGA) - Wire Bond - A:2.40
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EP4CGX30CF23C7N - Intel  - 3D model - BGA - 484-Pin FineLine Ball-Grid Array (FBGA) - Wire Bond - A:2.40
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EP4CGX30CF23C7N Details

  • Manufacturer Part Number:

    EP4CGX30CF23C7N

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    23 X 23 MM, 1 MM PITCH, LEAD FREE, FBGA-484

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan, USA, Vietnam

  • ECCN Code:

    3A991

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    7

  • Clock Frequency-Max:

    472.5 MHz

  • JESD-30 Code:

    S-PBGA-B484

  • JESD-609 Code:

    e1

  • Length:

    23 mm

  • Moisture Sensitivity Level:

    3

  • Number of CLBs:

    1840

  • Number of Inputs:

    290

  • Number of Logic Cells:

    29440

  • Number of Outputs:

    290

  • Number of Terminals:

    484

  • Operating Temperature-Max:

    85 °C

  • Organization:

    1840 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA484,22X22,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2.4 mm

  • Supply Voltage-Max:

    1.24 V

  • Supply Voltage-Min:

    1.16 V

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Technology:

    60 nm

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    23 mm

EP4CGX30CF23C7N Frequently Asked Questions (FAQs)

  • The maximum power consumption of EP4CGX30CF23C7N is approximately 1.1W, but it can vary depending on the specific use case and operating conditions.
  • To implement a reliable clocking scheme, use a high-quality clock source, such as a crystal oscillator, and ensure that the clock signal is properly routed and terminated. Additionally, consider using a clock domain crossing (CDC) circuit to synchronize clock domains.
  • The maximum operating frequency of EP4CGX30CF23C7N is 230 MHz, but it can be overclocked to higher frequencies with proper cooling and power management.
  • To optimize power consumption, use power-saving features such as clock gating, dynamic voltage and frequency scaling, and power gating. Additionally, optimize the design to minimize switching activity and use low-power modes when possible.
  • The maximum temperature range for EP4CGX30CF23C7N is -40°C to 100°C, but it can be extended to -55°C to 125°C with proper cooling and thermal management.

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EP4CGX30CF23C7N Overview

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Image Part Number Model
Part Image EP4CGX30CF23I7N Intel Corporation

Field Programmable Gate Array, 1840 CLBs, 472.5MHz, 29440-Cell, PBGA484

Part Image EP4CGX30CF23I7 Altera Corporation

Field Programmable Gate Array, 1840 CLBs, 472.5MHz, 29440-Cell, PBGA484