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EP4CGX30CF23C8N - Intel

Description: Cyclone® IV GX Field Programmable Gate Array (FPGA) IC 290 1105920 29440 484-BGA

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EP4CGX30CF23C8N - Intel PCB footprint - BGA - BGA - 484-Pin FineLine Ball-Grid Array (FBGA) - Wire Bond - A:2.40_2024
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EP4CGX30CF23C8N - Intel  - 3D model - BGA - 484-Pin FineLine Ball-Grid Array (FBGA) - Wire Bond - A:2.40_2024
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EP4CGX30CF23C8N Details

  • Manufacturer Part Number:

    EP4CGX30CF23C8N

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    23 X 23 MM, 1 MM PITCH, LEAD FREE, FBGA-484

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan, USA, Vietnam

  • ECCN Code:

    3A991

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    7

  • Clock Frequency-Max:

    472.5 MHz

  • JESD-30 Code:

    S-PBGA-B484

  • JESD-609 Code:

    e1

  • Length:

    23 mm

  • Moisture Sensitivity Level:

    3

  • Number of CLBs:

    1840

  • Number of Inputs:

    290

  • Number of Logic Cells:

    29440

  • Number of Outputs:

    290

  • Number of Terminals:

    484

  • Operating Temperature-Max:

    85 °C

  • Organization:

    1840 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA484,22X22,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2.4 mm

  • Supply Voltage-Max:

    1.24 V

  • Supply Voltage-Min:

    1.16 V

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Technology:

    60 nm

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    23 mm

EP4CGX30CF23C8N Frequently Asked Questions (FAQs)

  • The maximum power consumption of EP4CGX30CF23C8N is 1.1W, but it can vary depending on the usage and configuration of the device.
  • You can implement a clock management scheme for EP4CGX30CF23C8N using the clock management unit (CMU) and the phase-locked loop (PLL) blocks. The CMU generates the clock signals, and the PLL blocks multiply and divide the clock signals to generate the required frequencies.
  • The maximum frequency of operation for EP4CGX30CF23C8N is 230 MHz, but it can be overclocked to higher frequencies with proper cooling and power management.
  • You can configure the I/O banks of EP4CGX30CF23C8N using the I/O bank controller. The I/O bank controller allows you to configure the voltage, current, and slew rate of each I/O bank.
  • The maximum amount of memory that EP4CGX30CF23C8N can address is 16 MB, but it can be extended using external memory interfaces such as DDR3 and QDR II+.

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EP4CGX30CF23C8N Overview

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Part Image EP4CGX30CF23C8 Altera Corporation

Field Programmable Gate Array, 1840 CLBs, 472.5MHz, 29440-Cell, PBGA484