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EP4CGX50CF23C8N - Intel

Description: Altera FPGA EP4CGX50CF23C8N, Cyclone IV GX 49888 Cells, 2502kbit, 3118 Blocks, 484-Pin FBGA

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EP4CGX50CF23C8N - Intel PCB footprint - BGA - BGA - 484-Pin FineLine Ball-Grid Array (FBGA) - Wire Bond - A:2.40
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EP4CGX50CF23C8N - Intel  - 3D model - BGA - 484-Pin FineLine Ball-Grid Array (FBGA) - Wire Bond - A:2.40
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EP4CGX50CF23C8N Details

  • Manufacturer Part Number:

    EP4CGX50CF23C8N

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    23 X 23 MM, 1 MM PITCH, LEAD FREE, FBGA-484

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan, USA, Vietnam

  • ECCN Code:

    3A991

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    7

  • Clock Frequency-Max:

    472.5 MHz

  • JESD-30 Code:

    S-PBGA-B484

  • JESD-609 Code:

    e1

  • Length:

    23 mm

  • Moisture Sensitivity Level:

    3

  • Number of CLBs:

    3118

  • Number of Inputs:

    290

  • Number of Logic Cells:

    49888

  • Number of Outputs:

    290

  • Number of Terminals:

    484

  • Operating Temperature-Max:

    85 °C

  • Organization:

    3118 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA484,22X22,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2.4 mm

  • Supply Voltage-Max:

    1.24 V

  • Supply Voltage-Min:

    1.16 V

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Technology:

    60 nm

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    23 mm

EP4CGX50CF23C8N Frequently Asked Questions (FAQs)

  • The maximum power consumption of EP4CGX50CF23C8N is approximately 2.5W, but it can vary depending on the specific use case and operating conditions.
  • To optimize the performance of EP4CGX50CF23C8N, ensure that the device is properly cooled, use the optimal clock frequency, and optimize the design to minimize power consumption. Additionally, use the Intel Quartus II software to optimize the FPGA design for performance.
  • The maximum operating temperature of EP4CGX50CF23C8N is 100°C (industrial temperature range) and 85°C (commercial temperature range).
  • To ensure the reliability of EP4CGX50CF23C8N in harsh environments, follow proper design and manufacturing guidelines, use a robust PCB design, and ensure proper thermal management. Additionally, consider using conformal coating and other environmental protection measures.
  • EP4CGX50CF23C8N is a radiation-tolerant device, but it's not radiation-hardened. It's designed to withstand certain levels of radiation, but it's not suitable for high-radiation environments. Consult the datasheet and Intel's radiation effects documentation for more information.

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EP4CGX50CF23C8N Overview

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Part Image EP4CGX50CF23C8N Altera Corporation

Field Programmable Gate Array, 3118 CLBs, 472.5MHz, 49888-Cell, PBGA484

Part Image EP4CGX50CF23C8 Altera Corporation

Field Programmable Gate Array, 3118 CLBs, 472.5MHz, 49888-Cell, PBGA484