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EP4CGX75DF27C7N - Intel

Description: FPGA Cyclone® IV GX Family 73920 Cells 60nm Technology 1.2V 672-Pin FBGA

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EP4CGX75DF27C7N - Intel PCB footprint - BGA - BGA - 672-Pin FineLine Ball-Grid Array (FBGA) - Wire Bond - A:2.40
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EP4CGX75DF27C7N - Intel  - 3D model - BGA - 672-Pin FineLine Ball-Grid Array (FBGA) - Wire Bond - A:2.40
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EP4CGX75DF27C7N Details

  • Manufacturer Part Number:

    EP4CGX75DF27C7N

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    27 X 27 MM, 1 MM PITCH, LEAD FREE, FBGA-672

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan, USA, Vietnam

  • ECCN Code:

    3A991

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    7

  • Clock Frequency-Max:

    472.5 MHz

  • JESD-30 Code:

    S-PBGA-B672

  • JESD-609 Code:

    e1

  • Length:

    27 mm

  • Moisture Sensitivity Level:

    3

  • Number of CLBs:

    4620

  • Number of Inputs:

    310

  • Number of Logic Cells:

    73920

  • Number of Outputs:

    310

  • Number of Terminals:

    672

  • Operating Temperature-Max:

    85 °C

  • Organization:

    4620 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA672,26X26,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2.4 mm

  • Supply Voltage-Max:

    1.24 V

  • Supply Voltage-Min:

    1.16 V

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Technology:

    60 nm

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    27 mm

EP4CGX75DF27C7N Frequently Asked Questions (FAQs)

  • The maximum power consumption of EP4CGX75DF27C7N is approximately 2.5W, but it can vary depending on the specific use case and operating conditions.
  • To optimize the performance of EP4CGX75DF27C7N, ensure proper cooling, use the optimal clock frequency, and optimize the design to minimize power consumption. Additionally, use Intel's Quartus II software to optimize the FPGA design for performance.
  • The maximum operating temperature of EP4CGX75DF27C7N is 100°C (212°F), but it's recommended to operate within the industrial temperature range of -40°C to 100°C (-40°F to 212°F) for optimal performance and reliability.
  • EP4CGX75DF27C7N is not radiation-hardened, so it's not recommended for use in radiation-intensive environments. If you need a radiation-hardened FPGA, consider Intel's radiation-tolerant FPGAs, such as the RT ProASIC3 or the RTAX series.
  • To ensure the reliability of EP4CGX75DF27C7N in high-reliability applications, follow Intel's recommended design and manufacturing guidelines, use proper thermal management, and implement robust testing and validation procedures.

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EP4CGX75DF27C7N Overview

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Part Image EP4CGX75DF27I7N Intel Corporation

Field Programmable Gate Array, 4620 CLBs, 472.5MHz, 73920-Cell, PBGA672

Part Image EP4CGX75DF27I7 Intel Corporation

Field Programmable Gate Array, 4620 CLBs, 472.5MHz, 73920-Cell, PBGA672

Part Image EP4CGX75DF27C7N Altera Corporation

Field Programmable Gate Array, 4620 CLBs, 472.5MHz, 73920-Cell, PBGA672

Part Image EP4CGX75DF27I7N Altera Corporation

Field Programmable Gate Array, 4620 CLBs, 472.5MHz, 73920-Cell, PBGA672

Part Image EP4CGX75DF27I7 Altera Corporation

Field Programmable Gate Array, 4620 CLBs, 472.5MHz, 73920-Cell, PBGA672

For a full list of alternate parts for EP4CGX75DF27C7N, check out Findchips.com