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EP4SGX110DF29C2XN - Intel

Description: Stratix IV, IC FPGA 372 I/O 780FBGA

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PCB Footprints
EP4SGX110DF29C2XN - Intel PCB footprint - BGA - BGA - 780-Pin FineLine Ball-Grid Array (FBGA) - Flip Chip - Single-Piece Lid - A:3.30 - D1:21.0
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3D Models
EP4SGX110DF29C2XN - Intel  - 3D model - BGA - 780-Pin FineLine Ball-Grid Array (FBGA) - Flip Chip - Single-Piece Lid - A:3.30 - D1:21.0
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EP4SGX110DF29C2XN Details

  • Manufacturer Part Number:

    EP4SGX110DF29C2XN

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    29 X 29 MM, LEAD FREE, FBGA-780

  • HTS Code:

    8542.31.00.60

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    0

  • Clock Frequency-Max:

    800 MHz

  • JESD-30 Code:

    S-PBGA-B780

  • JESD-609 Code:

    e1

  • Length:

    29 mm

  • Number of CLBs:

    4224

  • Number of Inputs:

    372

  • Number of Logic Cells:

    105600

  • Number of Outputs:

    372

  • Number of Terminals:

    780

  • Operating Temperature-Max:

    85 °C

  • Organization:

    4224 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA780,28X28,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    3.3 mm

  • Supply Voltage-Max:

    0.93 V

  • Supply Voltage-Min:

    0.87 V

  • Supply Voltage-Nom:

    0.9 V

  • Surface Mount:

    YES

  • Technology:

    CMOS, 40 nm

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    29 mm

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EP4SGX110DF29C2XN Overview

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Part Image EP4SGX110DF29C2X Altera Corporation

Field Programmable Gate Array, 4224 CLBs, 800MHz, 105600-Cell, CMOS, PBGA780

Part Image EP4SGX110DF29C2XN Altera Corporation

Field Programmable Gate Array, 4224 CLBs, 800MHz, 105600-Cell, CMOS, PBGA780