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EP4SGX180DF29I3N - Intel

Description: FPGA - Field Programmable Gate Array FPGA - Stratix IV GX 7030 LABs 372 IOs

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EP4SGX180DF29I3N - Intel PCB footprint - BGA - BGA - 780-Pin FineLine Ball-Grid Array (FBGA) - Flip Chip - Channel Lid - A:3.50
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EP4SGX180DF29I3N - Intel  - 3D model - BGA - 780-Pin FineLine Ball-Grid Array (FBGA) - Flip Chip - Channel Lid - A:3.50
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EP4SGX180DF29I3N Details

  • Manufacturer Part Number:

    EP4SGX180DF29I3N

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    29 X 29 MM, LEAD FREE, FBGA-780

  • HTS Code:

    8542.31.00.60

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    0

  • Clock Frequency-Max:

    717 MHz

  • JESD-30 Code:

    S-PBGA-B780

  • JESD-609 Code:

    e1

  • Length:

    29 mm

  • Number of CLBs:

    7030

  • Number of Inputs:

    372

  • Number of Logic Cells:

    175750

  • Number of Outputs:

    372

  • Number of Terminals:

    780

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    7030 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA780,28X28,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    3.5 mm

  • Supply Voltage-Max:

    0.93 V

  • Supply Voltage-Min:

    0.87 V

  • Supply Voltage-Nom:

    0.9 V

  • Surface Mount:

    YES

  • Technology:

    40 nm

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    29 mm

EP4SGX180DF29I3N Frequently Asked Questions (FAQs)

  • The maximum power consumption of EP4SGX180DF29I3N is around 25W, but it can vary depending on the specific use case and operating conditions.
  • To optimize the performance of EP4SGX180DF29I3N, you can use Intel's Quartus Prime software to optimize the design, reduce power consumption, and improve thermal performance. Additionally, you can use Intel's PowerPlay power management technology to dynamically adjust power consumption based on the system's workload.
  • The maximum operating temperature of EP4SGX180DF29I3N is 100°C, but it's recommended to operate it at a temperature below 85°C for optimal performance and reliability.
  • To ensure the reliability of EP4SGX180DF29I3N in harsh environments, you can use Intel's ruggedized packaging options, such as the FCBGA (Flip Chip Ball Grid Array) package, which provides improved thermal performance and mechanical robustness. Additionally, you can use conformal coating and other environmental protection measures to protect the device from moisture, dust, and other environmental factors.
  • The minimum order quantity for EP4SGX180DF29I3N varies depending on the specific packaging and delivery options. Typically, the minimum order quantity is around 100-500 units, but it's best to check with Intel or an authorized distributor for the most up-to-date information.

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EP4SGX180DF29I3N Overview

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EP4SGX180DF29I3N Alternates

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Image Part Number Model
Part Image EP4SGX180DF29I3 Altera Corporation

Field Programmable Gate Array, 7030 CLBs, 717MHz, 175750-Cell, CMOS, PBGA780

Part Image EP4SGX180DF29C3N Altera Corporation

Field Programmable Gate Array, 7030 CLBs, 717MHz, 175750-Cell, CMOS, PBGA780

Part Image EP4SGX180DF29C3N Intel Corporation

Field Programmable Gate Array, 7030 CLBs, 717MHz, 175750-Cell, PBGA780

Part Image EP4SGX180DF29I3 Intel Corporation

Field Programmable Gate Array, 7030 CLBs, 717MHz, 175750-Cell, CMOS, PBGA780

Part Image EP4SGX180DF29C3 Intel Corporation

Field Programmable Gate Array, 7030 CLBs, 717MHz, 175750-Cell, CMOS, PBGA780

For a full list of alternate parts for EP4SGX180DF29I3N, check out Findchips.com