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EP4SGX360FF35C3N - Intel

Description: IC FPGA 564 I/O 1152FBGA

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EP4SGX360FF35C3N - Intel - PCB symbol
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PCB Footprints
EP4SGX360FF35C3N - Intel PCB footprint - BGA - BGA - 1152-Pin FBGA - Flip Chip - Flat Top SPL - A:3.50
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EP4SGX360FF35C3N - Intel - 3D model - BGA - 1152-Pin FBGA - Flip Chip - Flat Top SPL - A:3.50
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EP4SGX360FF35C3N Details

  • Manufacturer Part Number:

    EP4SGX360FF35C3N

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    35 X 35 MM, LEAD FREE, FBGA-1152

  • HTS Code:

    8542.31.00.60

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    0

  • Clock Frequency-Max:

    717 MHz

  • JESD-30 Code:

    S-PBGA-B1152

  • JESD-609 Code:

    e1

  • Length:

    35 mm

  • Moisture Sensitivity Level:

    3

  • Number of CLBs:

    14144

  • Number of Inputs:

    564

  • Number of Logic Cells:

    353600

  • Number of Outputs:

    564

  • Number of Terminals:

    1152

  • Operating Temperature-Max:

    85 °C

  • Organization:

    14144 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA1152,34X34,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    245

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    3.4 mm

  • Supply Voltage-Max:

    0.93 V

  • Supply Voltage-Min:

    0.87 V

  • Supply Voltage-Nom:

    0.9 V

  • Surface Mount:

    YES

  • Technology:

    40 nm

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    35 mm

EP4SGX360FF35C3N Frequently Asked Questions (FAQs)

  • The maximum power consumption of EP4SGX360FF35C3N is approximately 25W, but it can vary depending on the specific use case and operating conditions.
  • To optimize the performance of EP4SGX360FF35C3N, ensure proper cooling, use the optimal clock frequency, and optimize the design for parallel processing. Additionally, consider using Intel's development tools and software development kits (SDKs) to optimize performance.
  • The maximum operating temperature of EP4SGX360FF35C3N is 100°C (212°F), but it's recommended to operate within a temperature range of 0°C to 85°C (32°F to 185°F) for optimal performance and reliability.
  • Yes, EP4SGX360FF35C3N is suitable for high-reliability applications, such as aerospace, defense, and industrial control systems, due to its rugged design and ability to operate in harsh environments.
  • To ensure the security of your design using EP4SGX360FF35C3N, implement secure boot mechanisms, use encryption and secure communication protocols, and follow Intel's security guidelines and recommendations.

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EP4SGX360FF35C3N Overview

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EP4SGX360FF35C3N Alternates

Showing results

Image Part Number Model
Part Image EP4SGX360FF35I3 Altera Corporation

Field Programmable Gate Array, 14144 CLBs, 717MHz, 353600-Cell, CMOS, PBGA1152
Part Image EP4SGX360FF35C3 Altera Corporation

Field Programmable Gate Array, 14144 CLBs, 717MHz, 353600-Cell, CMOS, PBGA1152
Part Image EP4SGX360FF35I3N Intel Corporation

Field Programmable Gate Array, 14144 CLBs, 717MHz, 353600-Cell, PBGA1152
Part Image EP4SGX360FF35C3 Intel Corporation

Field Programmable Gate Array, 14144 CLBs, 717MHz, 353600-Cell, CMOS, PBGA1152
Part Image EP4SGX360FF35I3 Intel Corporation

Field Programmable Gate Array, 14144 CLBs, 717MHz, 353600-Cell, CMOS, PBGA1152
For a full list of alternate parts for EP4SGX360FF35C3N, check out Findchips.com