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EP4SGX70HF35C2G - Intel

Description: IC FPGA 488 I/O 1152FBGA

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EP4SGX70HF35C2G - Intel - PCB symbol
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PCB Footprints
EP4SGX70HF35C2G - Intel PCB footprint - BGA - BGA - 1152-Pin FBGA - Flip Chip - Flat Top SPL - A:3.50
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3D Models
EP4SGX70HF35C2G - Intel - 3D model - BGA - 1152-Pin FBGA - Flip Chip - Flat Top SPL - A:3.50
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EP4SGX70HF35C2G Details

  • Manufacturer Part Number:

    EP4SGX70HF35C2G

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    FBGA-1152

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan, USA, Vietnam

  • HTS Code:

    8542.31.00.60

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    10

  • JESD-30 Code:

    S-PBGA-B1152

  • JESD-609 Code:

    e1

  • Length:

    35 mm

  • Moisture Sensitivity Level:

    3

  • Number of CLBs:

    2904

  • Number of Terminals:

    1152

  • Operating Temperature-Max:

    85 °C

  • Organization:

    2904 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA1152,34X34,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    245

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Seated Height-Max:

    3.5 mm

  • Surface Mount:

    YES

  • Technology:

    40 nm

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    35 mm

EP4SGX70HF35C2G Frequently Asked Questions (FAQs)

  • The maximum power consumption of EP4SGX70HF35C2G is approximately 12W, but it can vary depending on the specific use case and operating conditions.
  • To optimize the performance of EP4SGX70HF35C2G, ensure proper cooling, use the optimal clock frequency, and optimize the design for parallel processing. Additionally, use Intel's Quartus II software to optimize the FPGA design.
  • The maximum operating temperature of EP4SGX70HF35C2G is 100°C (212°F), but it's recommended to operate within the industrial temperature range of -40°C to 100°C (-40°F to 212°F) for optimal performance and reliability.
  • No, EP4SGX70HF35C2G is not designed for use in radiation-intensive environments. For such applications, consider using radiation-hardened FPGAs from Intel or other manufacturers.
  • To ensure the security of your design on EP4SGX70HF35C2G, use Intel's security features such as the Secure Boot mechanism, encrypt your design files, and implement secure communication protocols. Additionally, follow best practices for secure coding and testing.

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EP4SGX70HF35C2G Overview

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EP4SGX70HF35C2G Alternates

Showing results

Image Part Number Model
Part Image EP4SGX70HF35I2N Intel Corporation

Field Programmable Gate Array, 2904 CLBs, 800MHz, PBGA1152
Part Image EP4SGX70HF35C2N Altera Corporation

Field Programmable Gate Array, 29040 CLBs, 800MHz, 72600-Cell, CMOS, PBGA1152
Part Image EP4SGX70HF35C2 Altera Corporation

Field Programmable Gate Array, 29040 CLBs, 800MHz, 72600-Cell, CMOS, PBGA1152
Part Image EP4SGX70HF35C2N Intel Corporation

Field Programmable Gate Array, 2904 CLBs, 800MHz, 72600-Cell, CMOS, PBGA1152
Part Image EP4SGX70HF35C2 Intel Corporation

Field Programmable Gate Array, 2904 CLBs, 800MHz, 72600-Cell, CMOS, PBGA1152
For a full list of alternate parts for EP4SGX70HF35C2G, check out Findchips.com