Part Image

EPC2034C - Efficient Power Conversion

Description: – Enhancement Mode Power Transistor VDS , 200 V RDS(on) , 8 mΩ ID , 48 A

Download EPC2034C Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
PCB Footprints
EPC2034C - Efficient Power Conversion PCB footprint - Other - Other - EPC2034C-2
click to zoom
3D Models
EPC2034C - Efficient Power Conversion  - 3D model - Other - EPC2034C-2
click to zoom

EPC2034C Details

  • Manufacturer Part Number:

    EPC2034C

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Contact Manufacturer

  • Package Description:

    DIE-24

  • ECCN Code:

    EAR99

  • Manufacturer:

    Efficient Power Conversion

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    200 V

  • Drain Current-Max (ID):

    48 A

  • Drain-source On Resistance-Max:

    0.008 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-XUUC-B24

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    24

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Shape:

    RECTANGULAR

  • Package Style:

    UNCASED CHIP

  • Polarity/Channel Type:

    N-CHANNEL

  • Pulsed Drain Current-Max (IDM):

    213 A

  • Surface Mount:

    YES

  • Terminal Form:

    BALL

  • Terminal Position:

    UPPER

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    GALLIUM NITRIDE

EPC2034C Frequently Asked Questions (FAQs)

  • A good PCB layout for the EPC2034C involves keeping the high-frequency loops small, using a solid ground plane, and minimizing the distance between the device and the decoupling capacitors. A 4-layer PCB with a dedicated power plane and a solid ground plane is recommended.
  • The EPC2034C has a thermal pad that must be connected to a thermal heatsink or a metal plate on the PCB. A thermal interface material (TIM) can be used to improve heat transfer. Ensure good airflow around the device and avoid blocking the airflow with components or obstacles.
  • The maximum allowed voltage on the VIN pin is 5.5V. Exceeding this voltage may damage the device. It is recommended to use a voltage regulator or a voltage limiter to ensure the input voltage remains within the specified range.
  • To configure the EPC2034C for high-frequency operation, ensure that the input capacitance is minimized, and the output capacitance is optimized for the desired frequency. Use a low-ESR output capacitor and a high-frequency-compatible inductor. Additionally, optimize the PCB layout to minimize parasitic inductance and capacitance.
  • The recommended input capacitance for the EPC2034C is 10uF to 22uF, with an ESR of less than 100mΩ. A ceramic capacitor with an X5R or X7R dielectric is recommended.

Trust Checks

This model has been verified by system checks.
System Verified
Sponsored

EPC2034C Overview

Use the download button to access the EPC2034C schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like EPC20, or try a keyword search, such as Power Field-Effect Transistors

Parts related to EPC2034C

Showing 0 results