Part Image

EPC2052 - Efficient Power Conversion

Description: N-Channel 100 V 8.2A (Ta) Surface Mount Die

Download EPC2052 Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
PCB Footprints
EPC2052 - Efficient Power Conversion PCB footprint - Other - Other - EPC2052-4
click to zoom
3D Models
EPC2052 - Efficient Power Conversion  - 3D model - Other - EPC2052-4
click to zoom

EPC2052 Details

  • Manufacturer Part Number:

    EPC2052

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Contact Manufacturer

  • Package Description:

    DIE-9

  • ECCN Code:

    EAR99

  • Manufacturer:

    Efficient Power Conversion

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    100 V

  • Drain Current-Max (ID):

    8.2 A

  • Drain-source On Resistance-Max:

    0.0135 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    3.2 pF

  • JESD-30 Code:

    S-XUUC-X9

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    9

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Shape:

    SQUARE

  • Package Style:

    UNCASED CHIP

  • Polarity/Channel Type:

    N-CHANNEL

  • Pulsed Drain Current-Max (IDM):

    74 A

  • Surface Mount:

    YES

  • Terminal Form:

    UNSPECIFIED

  • Terminal Position:

    UPPER

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    GALLIUM NITRIDE

EPC2052 Frequently Asked Questions (FAQs)

  • A good PCB layout for the EPC2052 involves keeping the high-frequency loops small, using a solid ground plane, and placing the device close to the power source. A 4-layer PCB with a dedicated power plane and a solid ground plane is recommended.
  • The EPC2052 has a thermal pad on the bottom of the package, which should be connected to a thermal plane on the PCB. A thermal interface material (TIM) can be used to improve heat transfer. Additionally, a heat sink or a fan can be used to further improve cooling.
  • The EPC2052 is designed to operate up to 100 MHz, but the actual operating frequency may be limited by the specific application and PCB layout.
  • The EPC2052 has built-in overvoltage protection (OVP) and overcurrent protection (OCP) features. Additionally, external protection circuits such as TVS diodes and fuses can be used to further protect the device.
  • A low-impedance drive circuit with a high-current capability is recommended to ensure proper switching of the EPC2052. A driver IC such as the UCC37322 or a discrete driver circuit with a low impedance output stage can be used.

Trust Checks

This model has been provided by community users.
Community Provided
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

EPC2052 Overview

Use the download button to access the EPC2052 schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like EPC20, or try a keyword search, such as Power Field-Effect Transistors

Parts related to EPC2052

Showing 0 results