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EPCQ16SI8N - Intel

Description: FPGA - Configuration Memory IC - Ser. Config Mem Flash 16Mb 50 MHz

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EPCQ16SI8N - Intel PCB footprint - Small Outline Packages - Small Outline Packages - 8-Pin Small Outline Integrated Circuit Package (SOIC) - Wire Bond
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EPCQ16SI8N - Intel  - 3D model - Small Outline Packages - 8-Pin Small Outline Integrated Circuit Package (SOIC) - Wire Bond
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  • Datasheet Download Datasheet
  • Stock & Prices $ Price & Stock for EPCQ16SI8N
  • Part Number EPCQ16SI8N
  • Manufacturer Intel
  • Pin Count 8
  • Part Category Integrated Circuit
  • Package Category Small Outline Packages
  • Footprint Name Small Outline Packages - 8-Pin Small Outline Integrated Circuit Package (SOIC) - Wire Bond
  • Released Date Apr 21, 2017
  • Last Modified Date Mar 7, 2023 4:10 PM UTC
  • Pinout / Pin List Click Here (Member Only)

EPCQ16SI8N Details

  • Manufacturer Part Number:

    EPCQ16SI8N

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    SOIC-8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.51

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    0

  • Clock Frequency-Max (fCLK):

    133 MHz

  • Data Retention Time-Min:

    20

  • Endurance:

    100000 Write/Erase Cycles

  • JESD-30 Code:

    R-PDSO-G8

  • Length:

    4.9 mm

  • Memory Density:

    16777216 bit

  • Memory IC Type:

    CONFIGURATION MEMORY

  • Memory Width:

    8

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Number of Words:

    2097152 words

  • Number of Words Code:

    2000000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    2MX8

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,2

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Parallel/Serial:

    SERIAL

  • Peak Reflow Temperature (Cel):

    260

  • Programming Voltage:

    3.3 V

  • Seated Height-Max:

    1.75 mm

  • Standby Current-Max:

    0.0001 A

  • Supply Current-Max:

    0.02 mA

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    2.7 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Type:

    NOR TYPE

  • Width:

    3.9 mm

  • Write Cycle Time-Max (tWC):

    8 ms

EPCQ16SI8N Frequently Asked Questions (FAQs)

  • The recommended operating temperature range for the EPCQ16SI8N is 0°C to 85°C (commercial temperature range) and -40°C to 100°C (industrial temperature range).
  • To ensure reliable data retention, it is recommended to follow the guidelines for power cycling, voltage supply, and temperature operating conditions as specified in the datasheet. Additionally, implementing a robust power-on reset (POR) circuit and ensuring a stable voltage supply can help maintain data integrity.
  • The EPCQ16SI8N supports a maximum clock frequency of 166 MHz.
  • The EPCQ16SI8N is not designed to operate in radiation-intensive environments. If your application requires radiation tolerance, you should consider using a radiation-hardened device or consult with Intel Corporation for custom solutions.
  • To implement a secure boot mechanism, you can use the EPCQ16SI8N's built-in security features, such as the Advanced Encryption Standard (AES) and the Secure Hash Algorithm (SHA). You can also use Intel's proprietary security features, such as the Intel Boot Loader (IBL) and the Intel Firmware Support Package (FSP). Consult the Intel documentation and security guidelines for more information.

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