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EPCQ32ASI8N - Intel

Description: FPGA - Configuration Memory

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EPCQ32ASI8N - Intel PCB footprint - Small Outline Packages - Small Outline Packages - 8-Pin Small Outline Integrated Circuit Package (SOIC) - Wire Bond _1
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EPCQ32ASI8N - Intel  - 3D model - Small Outline Packages - 8-Pin Small Outline Integrated Circuit Package (SOIC) - Wire Bond _1
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  • Datasheet Download Datasheet
  • Stock & Prices $ Price & Stock for EPCQ32ASI8N
  • Part Number EPCQ32ASI8N
  • Manufacturer Intel
  • Pin Count 8
  • Part Category Integrated Circuit
  • Package Category Small Outline Packages
  • Footprint Name Small Outline Packages - 8-Pin Small Outline Integrated Circuit Package (SOIC) - Wire Bond _1
  • Released Date Mar 11, 2020
  • Last Modified Date Mar 7, 2023 4:10 PM UTC
  • Pinout / Pin List Click Here (Member Only)

EPCQ32ASI8N Details

  • Manufacturer Part Number:

    EPCQ32ASI8N

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    SOIC-8

  • ECCN Code:

    3A991

  • HTS Code:

    8542.32.00.51

  • Date Of Intro:

    2017-08-04

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    5.6

  • Clock Frequency-Max (fCLK):

    100 MHz

  • Data Retention Time-Min:

    20

  • Endurance:

    100000 Write/Erase Cycles

  • JESD-30 Code:

    R-PDSO-G8

  • Length:

    4.9 mm

  • Memory Density:

    33554432 bit

  • Memory IC Type:

    CONFIGURATION MEMORY

  • Memory Width:

    8

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Number of Words:

    4194304 words

  • Number of Words Code:

    4000000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    4MX8

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Parallel/Serial:

    SERIAL

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Programming Voltage:

    3.3 V

  • Seated Height-Max:

    1.75 mm

  • Standby Current-Max:

    0.00005 A

  • Supply Current-Max:

    0.015 mA

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    2.7 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Type:

    NOR TYPE

  • Width:

    3.9 mm

EPCQ32ASI8N Frequently Asked Questions (FAQs)

  • The recommended operating temperature range for the EPCQ32ASI8N is 0°C to 85°C (commercial temperature range) and -40°C to 100°C (industrial temperature range).
  • To ensure reliable data retention, it is recommended to follow the guidelines for power cycling, voltage supply, and temperature operating conditions as specified in the datasheet. Additionally, it is important to follow proper programming and erase procedures to prevent data corruption.
  • The EPCQ32ASI8N supports up to 100,000 erase cycles, making it suitable for applications that require frequent data updates.
  • Yes, the EPCQ32ASI8N is AEC-Q100 qualified, making it suitable for use in automotive applications. However, it is essential to ensure that the device is used within the recommended operating conditions and follows the guidelines for automotive applications.
  • It is recommended to implement error detection and correction mechanisms, such as checksums and error-correcting codes, to handle errors and exceptions during programming or erase operations. Additionally, it is essential to follow the guidelines for error handling and recovery as specified in the datasheet.

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