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EPCQ4ASI8N - Intel

Description: FPGA - Configuration Memory

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EPCQ4ASI8N - Intel PCB footprint - Small Outline Packages - Small Outline Packages - 8-Pin Small Outline Integrated Circuit Package (SOIC) - Wire Bond _1
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EPCQ4ASI8N - Intel  - 3D model - Small Outline Packages - 8-Pin Small Outline Integrated Circuit Package (SOIC) - Wire Bond _1
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  • Datasheet Download Datasheet
  • Stock & Prices $ Price & Stock for EPCQ4ASI8N
  • Part Number EPCQ4ASI8N
  • Manufacturer Intel
  • Pin Count 8
  • Part Category Integrated Circuit
  • Package Category Small Outline Packages
  • Footprint Name Small Outline Packages - 8-Pin Small Outline Integrated Circuit Package (SOIC) - Wire Bond _1
  • Released Date Jul 19, 2018
  • Last Modified Date Mar 7, 2023 4:10 PM UTC
  • Pinout / Pin List Click Here (Member Only)

EPCQ4ASI8N Details

  • Manufacturer Part Number:

    EPCQ4ASI8N

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    SOIC-8

  • ECCN Code:

    3A991

  • HTS Code:

    8542.32.00.51

  • Date Of Intro:

    2017-08-04

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    5.1

  • Clock Frequency-Max (fCLK):

    100 MHz

  • Data Retention Time-Min:

    20

  • Endurance:

    100000 Write/Erase Cycles

  • JESD-30 Code:

    R-PDSO-G8

  • Length:

    4.9 mm

  • Memory Density:

    4194304 bit

  • Memory IC Type:

    CONFIGURATION MEMORY

  • Memory Width:

    8

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Number of Words:

    524288 words

  • Number of Words Code:

    512000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    512KX8

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Parallel/Serial:

    SERIAL

  • Peak Reflow Temperature (Cel):

    260

  • Programming Voltage:

    3.3 V

  • Seated Height-Max:

    1.75 mm

  • Standby Current-Max:

    0.00005 A

  • Supply Current-Max:

    0.005 mA

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    2.7 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

EPCQ4ASI8N Frequently Asked Questions (FAQs)

  • Intel recommends a 4-layer PCB with a solid ground plane, and a thermal design that ensures a maximum junction temperature of 100°C. A thermal pad on the bottom of the package helps with heat dissipation.
  • Use a signal integrity analysis tool to optimize trace lengths, impedance, and termination. Implement a multi-layer PCB with a solid ground plane, and use differential signaling and shielding to minimize noise.
  • The EPCQ4ASI8N requires a power-on sequence of VCCIO, then VCC, and a ramp-up time of 100 ms to ensure proper device operation and prevent latch-up.
  • Use a high-quality clock source, such as a crystal oscillator, and implement a clock tree with a single clock domain. Ensure clock signal integrity by using a clock buffer and minimizing clock skew.
  • Use a combination of high-frequency and low-frequency decoupling capacitors, with a total capacitance of at least 100 nF, and implement a power filter with a ferrite bead and a bypass capacitor to minimize power noise.

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