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EPF6016AFC256-2 - Intel

Description: IC FPGA 171 I/O 256FBGA

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PCB Footprints
EPF6016AFC256-2 - Intel PCB footprint - BGA - BGA - fbga-256 wire bond option 1
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3D Models
EPF6016AFC256-2 - Intel  - 3D model - BGA - fbga-256 wire bond option 1
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EPF6016AFC256-2 Details

  • Manufacturer Part Number:

    EPF6016AFC256-2

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    FINE LINE, BGA-256

  • HTS Code:

    8542.31.00.55

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    0

  • Clock Frequency-Max:

    153 MHz

  • JESD-30 Code:

    S-PBGA-B256

  • JESD-609 Code:

    e0

  • Length:

    17 mm

  • Moisture Sensitivity Level:

    3

  • Number of Dedicated Inputs:

    4

  • Number of I/O Lines:

    171

  • Number of Inputs:

    171

  • Number of Logic Cells:

    1320

  • Number of Outputs:

    171

  • Number of Terminals:

    256

  • Operating Temperature-Max:

    85 °C

  • Organization:

    4 DEDICATED INPUTS, 171 I/O

  • Output Function:

    MACROCELL

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA256,16X16,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Programmable Logic Type:

    LOADABLE PLD

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2.1 mm

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    TIN LEAD

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    17 mm

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EPF6016AFC256-2 Overview

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Part Image EPF6016AFC256-2N Altera Corporation

Loadable PLD, PBGA256