EPM1270F256C5N - Intel

EPM1270F256C5N Details

• Manufacturer Part Number:

  EPM1270F256C5N

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Transferred

• Package Description:

  FBGA-256

• Country Of Origin:

  Mainland China, Malaysia, Taiwan, USA, Vietnam

• ECCN Code:

  3A991

• HTS Code:

  8542.39.00.01

• Manufacturer:

  Intel Corporation

• YTEOL:

  5.4

• Additional Feature:

  IT CAN ALSO OPERATE AT 3.3V

• Clock Frequency-Max:

  172.4 MHz

• In-System Programmable:

  YES

• JESD-30 Code:

  S-PBGA-B256

• JESD-609 Code:

  e1

• JTAG BST:

  YES

• Length:

  17 mm

• Moisture Sensitivity Level:

  3

• Number of I/O Lines:

  212

• Number of Inputs:

  212

• Number of Macro Cells:

  980

• Number of Outputs:

  212

• Number of Terminals:

  256

• Operating Temperature-Max:

  85 °C

• Organization:

  0 DEDICATED INPUTS, 212 I/O

• Output Function:

  MACROCELL

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  BGA

• Package Equivalence Code:

  BGA256,16X16,40

• Package Shape:

  SQUARE

• Package Style:

  GRID ARRAY

• Peak Reflow Temperature (Cel):

  260

• Programmable Logic Type:

  FLASH PLD

• Propagation Delay:

  10 ns

• Qualification Status:

  Not Qualified

• Seated Height-Max:

  2.2 mm

• Supply Voltage-Max:

  2.625 V

• Supply Voltage-Min:

  2.375 V

• Supply Voltage-Nom:

  2.5 V

• Surface Mount:

  YES

• Technology:

  CMOS

• Temperature Grade:

  OTHER

• Terminal Finish:

  Tin/Silver/Copper (Sn/Ag/Cu)

• Terminal Form:

  BALL

• Terminal Pitch:

  1 mm

• Terminal Position:

  BOTTOM

• Time@Peak Reflow Temperature-Max (s):

  30

• Width:

  17 mm