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EPM1270GT144I5N - Intel

Description: CPLD - Complex Programmable Logic Devices CPLD - MAX II 980 Macro 116 IOs

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EPM1270GT144I5N - Intel PCB footprint - Quad Flat Packages - Quad Flat Packages - 144-Pin Plastic Thin Quad Flat Pack (TQFP) - Wire Bond - A:1.60
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EPM1270GT144I5N - Intel  - 3D model - Quad Flat Packages - 144-Pin Plastic Thin Quad Flat Pack (TQFP) - Wire Bond - A:1.60
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EPM1270GT144I5N Details

  • Manufacturer Part Number:

    EPM1270GT144I5N

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    TQFP-144

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan, USA, Vietnam

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    5.7

  • Additional Feature:

    IT CAN ALSO OPERATE AT 3.3V

  • Clock Frequency-Max:

    172.4 MHz

  • In-System Programmable:

    YES

  • JESD-30 Code:

    S-PQFP-G144

  • JESD-609 Code:

    e3

  • JTAG BST:

    YES

  • Length:

    20 mm

  • Moisture Sensitivity Level:

    3

  • Number of I/O Lines:

    116

  • Number of Inputs:

    116

  • Number of Macro Cells:

    980

  • Number of Outputs:

    116

  • Number of Terminals:

    144

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    0 DEDICATED INPUTS, 116 I/O

  • Output Function:

    MACROCELL

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFQFP

  • Package Equivalence Code:

    QFP144,.87SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, LOW PROFILE, FINE PITCH

  • Programmable Logic Type:

    FLASH PLD

  • Propagation Delay:

    10 ns

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.6 mm

  • Supply Voltage-Max:

    1.89 V

  • Supply Voltage-Min:

    1.71 V

  • Supply Voltage-Nom:

    1.8 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Width:

    20 mm

EPM1270GT144I5N Frequently Asked Questions (FAQs)

  • Intel provides a reference design guide for PCB layout and thermal management in the Cyclone III FPGA Development Kit User Guide. It's essential to follow these guidelines to ensure proper heat dissipation and signal integrity.
  • A POR circuit can be implemented using a voltage supervisor IC (e.g., TLV7031) or a discrete circuit with a voltage divider, capacitor, and resistor. The POR signal should be connected to the FPGA's nCONFIG pin.
  • Choose a clock source with low jitter and phase noise to ensure reliable operation. Consider using a crystal oscillator or a high-quality clock generator module. The clock frequency should be within the FPGA's specified range (e.g., 50 MHz to 200 MHz).
  • Use a reliable configuration device (e.g., EPCS16 or EPCS64) and follow Intel's configuration guidelines. Ensure the configuration clock (nCONFIG) is properly driven, and the FPGA is properly powered before configuration.
  • Use controlled impedance traces, and terminate signals according to Intel's guidelines. Ensure proper signal routing, and use series termination resistors for high-speed signals. Also, consider using Intel's Signal Integrity Tool to analyze and optimize signal integrity.

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EPM1270GT144I5N Overview

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Part Image EPM1270GT144A5 Intel Corporation

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Part Image EPM1270GT144A5N Altera Corporation

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Part Image EPM1270GT144I5 Intel Corporation

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