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EPM240F100C5N - Intel

Description: CPLD MAX® II Family 192 Macro Cells 201.1MHz 0.18um Technology 2.5V/3.3V Automotive 100-Pin TFBGA Tray

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EPM240F100C5N - Intel PCB footprint - BGA - BGA - 100 pin fbga
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EPM240F100C5N - Intel  - 3D model - BGA - 100 pin fbga
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EPM240F100C5N Details

  • Manufacturer Part Number:

    EPM240F100C5N

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    FBGA-100

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan, USA, Vietnam

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    5.4

  • Additional Feature:

    IT CAN ALSO OPERATE AT 3.3V

  • Clock Frequency-Max:

    166.6 MHz

  • In-System Programmable:

    YES

  • JESD-30 Code:

    S-PBGA-B100

  • JESD-609 Code:

    e1

  • JTAG BST:

    YES

  • Length:

    11 mm

  • Moisture Sensitivity Level:

    3

  • Number of I/O Lines:

    80

  • Number of Inputs:

    80

  • Number of Macro Cells:

    192

  • Number of Outputs:

    80

  • Number of Terminals:

    100

  • Operating Temperature-Max:

    85 °C

  • Organization:

    0 DEDICATED INPUTS, 80 I/O

  • Output Function:

    MACROCELL

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LBGA

  • Package Equivalence Code:

    BGA100,10X10,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Programmable Logic Type:

    FLASH PLD

  • Propagation Delay:

    7.5 ns

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.7 mm

  • Supply Voltage-Max:

    2.625 V

  • Supply Voltage-Min:

    2.375 V

  • Supply Voltage-Nom:

    2.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    11 mm

EPM240F100C5N Frequently Asked Questions (FAQs)

  • The recommended power-up sequence is to apply VCCINT first, followed by VCCIO, and then configure the device. This ensures that the internal voltage regulators are powered up correctly.
  • The CCLK should be driven low during power-up to prevent the device from configuring prematurely. Once the power supplies are stable, the CCLK can be driven high to initiate configuration.
  • The maximum frequency for the CCLK is 100 MHz. However, it is recommended to use a frequency of 50 MHz or less to ensure reliable configuration.
  • To ensure reliable configuration, use a high-quality configuration clock source, ensure the power supplies are stable, and use a reliable configuration data source, such as a flash memory device.
  • To handle SEUs, use error correction codes, such as CRC or ECC, to detect and correct errors in the configuration data. Additionally, use triple modular redundancy (TMR) or other mitigation techniques to detect and correct errors in the FPGA fabric.

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EPM240F100C5N Overview

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